TELEPORTATION SYSTEMS TOWARD A QUANTUM INTERNET

    公开(公告)号:US20240275494A1

    公开(公告)日:2024-08-15

    申请号:US18073245

    申请日:2022-12-01

    IPC分类号: H04B10/70 H04B10/079 H04L7/00

    摘要: Quantum teleportation is essential for many quantum information technologies, including long-distance quantum networks. Using fiber-coupled devices, including state-of-the-art low-noise superconducting nanowire single-photon detectors and off-the-shelf optics, we achieve conditional quantum teleportation of time-bin qubits at the telecommunication wavelength of 1536.5 nm. We measure teleportation fidelities of ≥9% that are consistent with an analytical model of our system, which includes realistic imperfections. To demonstrate the compatibility of our setup with deployed quantum networks, we teleport qubits over 22 km of single-mode fiber while transmitting qubits over an additional 22 km of fiber. Our systems, which are compatible with emerging solid-state quantum devices, provide a realistic foundation for a high-fidelity quantum Internet with practical devices.

    Thin film electret microphone
    2.
    发明申请
    Thin film electret microphone 失效
    薄膜驻极体麦克风

    公开(公告)号:US20010033670A1

    公开(公告)日:2001-10-25

    申请号:US09859191

    申请日:2001-05-15

    IPC分类号: H04R017/00 H04R025/00

    摘要: An electret formed by micro-machining technology on a support surface, including a self-powered electret sound transducer, preferably in the form of a microphone, formed by micro-machining technology. Each microphone is manufactured as a two-piece unit, comprising a microphone membrane unit and a microphone back plate, at least one of which includes an electret formed by micro-machining technology. When juxtaposed, the two units form a microphone that can produce a signal without the need for external biasing, thereby reducing system volume and complexity. The electret material used is a thin film of spin-on polytetrafluoroethylene (PTFE). An electron gun preferably is used for charge implantation. The electret has a saturated charged density in the range of about 2null10null5 C/m2 to about 8null10null4 C/m2. Thermal annealing is used to stabilize the implanted charge. An open circuit sensitivity of about 0.5 mV/Pa has been achieved for a hybrid microphone package.

    摘要翻译: 通过微加工技术在支撑表面上形成的驻极体,其包括通过微加工技术形成的优选以麦克风形式的自供电的驻极体声音传感器。 每个麦克风被制造成两件式的单元,其包括麦克风膜单元和麦克风背板,其中至少一个包括由微加工技术形成的驻极体。 当并置时,两个单元形成麦克风,其可以产生信号而不需要外部偏置,从而降低系统体积和复杂性。 使用的驻极体材料是旋涂聚四氟乙烯(PTFE)的薄膜。 电子枪优选用于电荷注入。 驻极体的饱和带电密度在约2×10 -5 C / m 2至约8×10 -4 C / m 2的范围内。 热退火用于稳定植入电荷。 对于混合麦克风封装已经实现了约0.5mV / Pa的开路灵敏度。

    SURFACE-COUPLED INTEGRATED-CAVITY SEMICONDUCTOR LASER

    公开(公告)号:US20240348015A1

    公开(公告)日:2024-10-17

    申请号:US18612461

    申请日:2024-03-21

    IPC分类号: H01S5/183 H01S5/04 H01S5/20

    摘要: A device including a chip including a photonic integrated circuit comprising an external cavity for a source of electromagnetic radiation; the source of electromagnetic radiation attached to a top surface of the chip, the source comprising a semiconductor active region comprising, or coupled to, an output for the electromagnetic radiation, wherein the output is oriented to emit the electromagnetic radiation into the top surface in an emission direction that is inclined with respect to a plane of propagation of the electromagnetic radiation in the external cavity; and a coupler coupling the active region to the external cavity via the top surface to integrate the external cavity with the active region. The coupler partially couples the electromagnetic radiation outputted from the active region to the external cavity, and feedback from the external cavity to the active region.

    Ultrasound measurement device
    8.
    发明授权

    公开(公告)号:US12102477B2

    公开(公告)日:2024-10-01

    申请号:US18128998

    申请日:2023-03-30

    摘要: An ultrasound measurement device includes: a processing device and multiple ultrasound sensors that capture tomographic information of a physiological structure. The ultrasound sensors include a first ultrasound sensor including a first transducer having a first frequency response with a first resonant frequency, and a second ultrasound sensor including a second transducer having a second frequency response with a second resonant frequency different from the first resonant frequency. The first frequency response partially overlaps with the second frequency response. The second transducer transmits an ultrasound signal that is reflected by the physiological structure to create a reflected ultrasound signal, the first transducer generates a first received signal from the reflected ultrasound signal, the second transducer generates a second received signal from the reflected ultrasound signal, and the processing device normalizes the first received signal with the second received signal or the second received signal with the first received signal.