Invention Application
- Patent Title: Dielectric materials preparation
- Patent Title (中): 电介质材料制备
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Application No.: US10976292Application Date: 2004-10-27
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Publication No.: US20050089642A1Publication Date: 2005-04-28
- Inventor: Timothy Adams , Hongshi Zhen , Gregory Prokopowicz , Michael Gallagher
- Applicant: Timothy Adams , Hongshi Zhen , Gregory Prokopowicz , Michael Gallagher
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials, L.L.C.
- Current Assignee: Rohm and Haas Electronic Materials, L.L.C.
- Current Assignee Address: US MA Marlborough
- Main IPC: C07F7/08
- IPC: C07F7/08 ; H01L21/312 ; B05D5/12 ; C07F7/04
Abstract:
A method of preparing an organic polysilica partial condensate using basic and acidic catalysts is provided. Upon curing, such organic polysilica material has improved mechanical properties.
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