Invention Application
- Patent Title: Multi-surface contact IC packaging structures and assemblies
- Patent Title (中): 多表面接触IC封装结构和组件
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Application No.: US10964578Application Date: 2004-10-12
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Publication No.: US20050093152A1Publication Date: 2005-05-05
- Inventor: Joseph Fjelstad , Para Segaram , Thomas Obenhuber , Inessa Obenhuber , Kevin Grundy , William Wiedemann
- Applicant: Joseph Fjelstad , Para Segaram , Thomas Obenhuber , Inessa Obenhuber , Kevin Grundy , William Wiedemann
- Main IPC: H01L
- IPC: H01L20060101 ; H01L23/13 ; H01L23/31 ; H01L23/48 ; H01L23/498 ; H01L25/065
Abstract:
A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.
Public/Granted literature
- US07732904B2 Multi-surface contact IC packaging structures and assemblies Public/Granted day:2010-06-08
Information query
