Invention Application
US20050098115A1 Atmospheric substrate processing apparatus for depositing multiple layers on a substrate
审中-公开
用于在基板上沉积多层的大气基板处理装置
- Patent Title: Atmospheric substrate processing apparatus for depositing multiple layers on a substrate
- Patent Title (中): 用于在基板上沉积多层的大气基板处理装置
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Application No.: US10992005Application Date: 2004-11-17
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Publication No.: US20050098115A1Publication Date: 2005-05-12
- Inventor: Michael Barnes , Michael Cox , Canfeng Lai , John Parks
- Applicant: Michael Barnes , Michael Cox , Canfeng Lai , John Parks
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23C16/54
- IPC: C23C16/54 ; C30B25/08 ; H01L21/00 ; C23C16/00
Abstract:
A substrate processing apparatus is disclosed. In one embodiment, the apparatus includes a first atmospheric deposition station and a second atmospheric deposition station. The second atmospheric deposition station comprises an atmospheric pressure vapor deposition chamber. A substrate handling system is adapted to transfer substrates between the first and the second atmospheric deposition stations.
Information query
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