发明申请
- 专利标题： Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
- 专利标题（中）： 薄膜电容器，包含薄膜电容器的高密度封装基板以及制造薄膜电容器的方法
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申请号： US10974789申请日： 2004-10-28
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公开(公告)号： US20050111162A1公开(公告)日： 2005-05-26
- 发明人: Tetsuya Osaka , Ichiro Koiwa , Akira Hashimoto , Yoshimi Sato
- 申请人： Tetsuya Osaka , Ichiro Koiwa , Akira Hashimoto , Yoshimi Sato
- 优先权： JP2003-373495 20031031; JP2004-052400 20040226
- 主分类号： H01G4/12
- IPC分类号： H01G4/12 ; H01G2/00 ; H01G4/008 ; H01G4/06 ; H01G4/30 ; H01G4/33 ; H01G13/00 ; H01G13/06 ; H01L21/822 ; H01L27/04 ; H05K1/16 ; H05K3/38 ; H05K3/46
摘要：
A capacitor capable of being incorporated into a packaging substrate, characterized in that the capacitor comprises a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.
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