发明申请
- 专利标题: Electrolytic processing apparatus and method
- 专利标题(中): 电解处理装置及方法
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申请号: US10500576申请日: 2003-01-07
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公开(公告)号: US20050115838A1公开(公告)日: 2005-06-02
- 发明人: Yuzo Mori , Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Yasushi Toma
- 申请人: Yuzo Mori , Mitsuhiko Shirakashi , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Yasushi Toma
- 优先权: JP2002-1737 20020108
- 国际申请: PCT/JP03/00038 WO 20030107
- 主分类号: B23H3/00
- IPC分类号: B23H3/00 ; B23H3/08 ; B23H5/08 ; C25F3/00 ; C25F7/00 ; C25B9/04 ; C25D21/12
摘要:
There is provided an electrolytic processing apparatus and method that can effect processing of a substrate with high processing precision and can produce an intended form of processed substrate with high accuracy of form. The electrolytic processing apparatus includes: a holder (30) for holding a substrate (W); a processing electrode (32) that can come close to the substrate; a feeding electrode (34) for feeding electricity to the substrate; an ion exchanger (40) disposed in the space between the substrate and the processing electrode, or the substrate and the feeding electrode; a fluid supply section (70) for supplying a fluid into the space; a power source (68) for applying a voltage between the processing electrode and the feeding electrode; a drive sections (44, 56 and 60) for allowing the substrate and the processing electrode, facing each other, to make a relative movement; and a numerical controller (72) for effecting a numerical control of the drive sections. ATTACHMENT “B”
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