发明申请
- 专利标题: Coating film forming method and coating film forming apparatus
- 专利标题(中): 涂膜成膜方法和涂膜成膜装置
-
申请号: US11043945申请日: 2005-01-28
-
公开(公告)号: US20050126474A1公开(公告)日: 2005-06-16
- 发明人: Kousuke Yoshihara , Yuichi Terashita
- 申请人: Kousuke Yoshihara , Yuichi Terashita
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2001-173137 20010607
- 主分类号: H01L21/203
- IPC分类号: H01L21/203 ; B05D1/00 ; B05D3/10 ; G03F7/16 ; H01L21/00 ; B05C11/02 ; B05C13/00
摘要:
A coating film is formed by the steps of supplying a mixture of a solvent for dissolving a coating liquid and a volatilization suppressing substance for suppressing the volatilization of the solvent onto the surface of the target substrate W, expanding the mixture onto the entire surface of the target substrate W, and supplying a coating liquid onto substantially the central portion of the target substrate W that has received the mixture while rotating the target substrate W thereby expanding the coating liquid outward in the radial direction of the target substrate W thereby forming a coating film.
信息查询
IPC分类: