发明申请
US20050157471A1 Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
审中-公开
集成散热器包装，用于传热和粘合线厚度控制和制造过程
- 专利标题： Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
- 专利标题（中）： 集成散热器包装，用于传热和粘合线厚度控制和制造过程
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申请号： US11080028申请日： 2005-03-15
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公开(公告)号： US20050157471A1公开(公告)日： 2005-07-21
- 发明人: Kris Whittenburg , Fay Hua , Carl Deppisch , Sabina Houle , Peter Brandenburger , Kim Phillippe
- 申请人： Kris Whittenburg , Fay Hua , Carl Deppisch , Sabina Houle , Peter Brandenburger , Kim Phillippe
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/433 ; H05K7/20
摘要：
A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.
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