公开(公告)号：US06867978B2

公开(公告)日：2005-03-15

申请号：US10266996

申请日：2002-10-08

申请人： Kris J. Whittenburg ,  Fay Hua ,  Carl L. Deppisch ,  Sabina J. Houle ,  Peter Brandenburger ,  Kim L. Phillippe

发明人： Kris J. Whittenburg ,  Fay Hua ,  Carl L. Deppisch ,  Sabina J. Houle ,  Peter Brandenburger ,  Kim L. Phillippe

IPC分类号： H01L23/373 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

公开(公告)号：US06256199B1

公开(公告)日：2001-07-03

申请号：US09410648

申请日：1999-10-01

申请人： Imran Yusuf ,  Hong Xie ,  Johnny M. Cook, Jr. ,  Peter Brandenburger ,  Biju Chandran ,  Hamid Ekhlassi

发明人： Imran Yusuf ,  Hong Xie ,  Johnny M. Cook, Jr. ,  Peter Brandenburger ,  Biju Chandran ,  Hamid Ekhlassi

IPC分类号： H05K720

CPC分类号： H01L23/40 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially even bond line thickness in the presence of opposing forces, such as forces caused by thermal cycling, power cycling, shocks, and vibration. The spring clip can modulate the compressive force applied as a function of parameters on the spring clip. Parameters include load arm width, load arm thickness, load arm curvature, and the location of tabs relative to load arms. A cartridge cover supplies physical protection for pins that protrude from the cartridge. The cartridge cover also supplies key features that aid in alignment of the pins and a socket.

摘要翻译： 已经描述了集成电路盒和方法。 该盒包括与至少一个集成电路管芯热接触的热管。 使用弹簧夹提供压缩力以在存在相反的力（例如由热循环，功率循环，冲击和振动引起的力）的情况下保持基本上均匀的接合线厚度。 弹簧夹可以根据弹簧夹上的参数调节施加的压缩力。 参数包括负载臂宽度，负载臂厚度，负载臂曲率以及接头相对于负载臂的位置。 墨盒盖为从墨盒突出的针脚提供物理保护。 墨盒盖还提供了有助于对齐针脚和插座的关键特征。

公开(公告)号：US20050157471A1

公开(公告)日：2005-07-21

申请号：US11080028

申请日：2005-03-15

申请人： Kris Whittenburg ,  Fay Hua ,  Carl Deppisch ,  Sabina Houle ,  Peter Brandenburger ,  Kim Phillippe

发明人： Kris Whittenburg ,  Fay Hua ,  Carl Deppisch ,  Sabina Houle ,  Peter Brandenburger ,  Kim Phillippe

IPC分类号： H01L23/373 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

摘要翻译： 系统包括用于将热量从模具传递到散热器的热界面材料（TIM）。 该系统包括设置在模具的背面上的传热系统。 在一个实施例中，传热子系统包括离散地设置在第一传热材料内的第一传热材料和第二传热材料。 将模具结合到散热器的方法使用与基板参考工艺相反的模具参考工艺。

公开(公告)号：US20050145846A1

公开(公告)日：2005-07-07

申请号：US10755172

申请日：2004-01-06

申请人： Peter Brandenburger

发明人： Peter Brandenburger

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/13

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/05599

摘要： Embodiments of the present invention include first and second substrate structures with underfill injected into a substrate structure interface through a feature of the substrate structure, a heat spreader, and the like.

摘要翻译： 本发明的实施例包括通过衬底结构的特征，散热器等将底部填充物注入衬底结构界面的第一和第二衬底结构。