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    COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE
    2.
    发明申请
    COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE 有权
    电子包装复合焊枪

    公开(公告)号：US20100259890A1

    公开(公告)日：2010-10-14

    申请号：US12822951

    申请日：2010-06-24

    申请人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： G06F1/20 ,  H05K7/20 ,  H01B1/02

    CPC分类号： C22C21/00 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/286 ,  B23K35/40 ,  C22C28/00 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

    摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。

    Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
    3.
    发明授权
    Reactive gettering in phase change solders to inhibit oxidation at contact surfaces 失效
    相变焊料中的反应性吸附剂以抑制接触表面的氧化

    公开(公告)号：US07727815B2

    公开(公告)日：2010-06-01

    申请号：US10954646

    申请日：2004-09-29

    申请人： Chad A. Kumaus ,  Carl Deppisch ,  Daewoong Suh ,  Ashay A. Dani

    发明人： Chad A. Kumaus ,  Carl Deppisch ,  Daewoong Suh ,  Ashay A. Dani

    IPC分类号： H01L21/44 ,  H01L21/48

    CPC分类号： H01L23/3736 ,  H01L23/053 ,  H01L23/26 ,  H01L2924/15311 ,  H01L2924/16195

    摘要： A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change temperature that is about the normal operating temperature range of the IC, to bind absorbed and dissolved oxygen in the two phase solder interface material at or near the air to solder surface. Over time this chemical binding action results in an oxide layer at the air to solder surface that slows the rate of oxygen absorption into the solder interface material, and thus reduces the harmful oxidation of the solder to IC package interface and the solder to heat sink interface.

    摘要翻译： 公开了一种用于在IC封装接口形成高导热性散热片的方法。 该方法使用反应性吸气剂材料添加到具有大约IC的正常操作温度范围的相变温度的两相焊料系统中，以将空气中或附近的两相焊料界面材料中的吸收和溶解的氧结合到焊料 表面。 随着时间的推移，这种化学结合作用导致空气到焊料表面的氧化物层，从而减慢了焊接界面材料中的氧吸收速率，从而减少了焊料对IC封装接口和焊料与散热片接口的有害氧化 。

    Composite solder TIM for electronic package
    5.
    发明申请
    Composite solder TIM for electronic package 有权
    复合焊料TIM用于电子封装

    公开(公告)号：US20080090405A1

    公开(公告)日：2008-04-17

    申请号：US11540027

    申请日：2006-09-29

    申请人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/44

    CPC分类号： C22C21/00 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/286 ,  B23K35/40 ,  C22C28/00 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

    摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。

    DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION
    6.
    发明申请
    DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION 失效
    具有受控热膨胀的散热器的装置和系统

    公开(公告)号：US20050121775A1

    公开(公告)日：2005-06-09

    申请号：US10726558

    申请日：2003-12-04

    申请人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/56 ,  H01L23/10 ,  H01L23/36 ,  H01L23/42

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

    摘要翻译： 装置和系统包括具有可控制的热膨胀的散热器。 例如，整体散热器可以包括由具有第一热膨胀系数的高热导率材料形成的插入件和由具有第二热膨胀系数的刚性材料形成的环，其中第二热膨胀系数为 小于或明显小于第一热膨胀系数。 整体散热器可以任选地包括例如电镀，涂层或贴片，并且可以包括在例如半导体器件中。

    Composite solder TIM for electronic package
    10.
    发明授权
    Composite solder TIM for electronic package 有权
    复合焊料TIM用于电子封装

    公开(公告)号：US07816250B2

    公开(公告)日：2010-10-19

    申请号：US11540027

    申请日：2006-09-29

    申请人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/208 ,  H01L33/62

    CPC分类号： C22C21/00 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/286 ,  B23K35/40 ,  C22C28/00 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

    摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。