发明申请
- 专利标题: Light source, method for manufacturing light source, and projector
- 专利标题(中): 光源,制造光源的方法和投影仪
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申请号: US11052220申请日: 2005-02-08
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公开(公告)号: US20050173719A1公开(公告)日: 2005-08-11
- 发明人: Masatoshi Yonekubo , Hideya Seki , Takashi Takeda
- 申请人: Masatoshi Yonekubo , Hideya Seki , Takashi Takeda
- 申请人地址: JP Tokyo
- 专利权人: SEIKO EPSON CORPORATION
- 当前专利权人: SEIKO EPSON CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2004-033484 20040210
- 主分类号: G02B6/42
- IPC分类号: G02B6/42 ; F21V7/00 ; F21V8/00 ; G02B6/00 ; G02F1/13 ; G02F1/13357 ; G03B21/00 ; G03B21/14 ; H01L27/15 ; H01L33/56 ; H01L33/58 ; H01L33/60 ; H01L33/62 ; H01L33/64
摘要:
A light source that has a small size can provide uniform light at high efficiency and can have a high degree of freedom in design, a method for manufacturing this light source, and a projector having this light source include a solid-state light-emitting chip that supplies G-light, which is light of a predetermined wavelength range, a support, a package mold, and a heat sink that constitute a solid-state light-emitting chip supporting part for supporting the solid-state light-emitting chip, an optical guide that reflects the G-light and thus causes the G-light to exit into an illuminating direction, and a support, which is an optical guide supporting part for supporting the optical guide. A light exiting surface of the solid-state light-emitting chip and a light incident surface of the optical guide are provided at a predetermined spacing. The solid-state light-emitting chip is, for example, an InGaN-based LED flip chip.
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