Invention Application
- Patent Title: Radio frequency circuit module
- Patent Title (中): 射频电路模块
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Application No.: US11013337Application Date: 2004-12-17
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Publication No.: US20050176380A1Publication Date: 2005-08-11
- Inventor: Hiroshi Okabe , Hidetoshi Matsumoto
- Applicant: Hiroshi Okabe , Hidetoshi Matsumoto
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Priority: JP2004-029111 20040205
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H04B1/38 ; H04B1/40 ; H05K1/00 ; H05K1/02 ; H05K1/18 ; H05K3/34 ; H05K3/46

Abstract:
An RF circuit module, in which a power amplifier and a transceiver are united, with reduced interference between its electronic circuit blocks, downsized and still having high performance, and with a stable performance not dependent on the ground land structure on the motherboard, is provided. The ground plane 110 for at least a last-stage amplifier 11 of the power amplifier 10 where the greatest power is generated in the whole RF circuit block, that is, the source of generating the greatest noise and heat for the RF circuit block, is isolated from the ground plane for at least one circuit portion of the transceiver 9 including an LNA 51, receiver 52, transmitter 30, and VCO 70. These ground planes are connected to a common ground plane 480 through different connection conductors, respectively.
Public/Granted literature
- US07515879B2 Radio frequency circuit module Public/Granted day:2009-04-07
Information query
IPC分类: