发明申请
- 专利标题： Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device
- 专利标题（中）： 清洗组合物，半导体基板的清洗方法以及半导体装置的制造方法
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申请号： US11052910申请日： 2005-02-09
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公开(公告)号： US20050176606A1公开(公告)日： 2005-08-11
- 发明人: Tomohisa Konno , Kiyonobu Kubota , Masayuki Hattori , Nobuo Kawahashi
- 申请人： Tomohisa Konno , Kiyonobu Kubota , Masayuki Hattori , Nobuo Kawahashi
- 申请人地址： JP Tokyo
- 专利权人： JSR Corporation
- 当前专利权人： JSR Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-033158 20040210
- 主分类号： B08B1/04
- IPC分类号： B08B1/04 ; B08B3/08 ; C11D3/37 ; C11D11/00 ; H01L21/02 ; H01L21/306 ; H01L21/3105 ; H01L21/321 ; C11D1/00
摘要：
The cleaning composition which comprises organic polymer particles (A) having a crosslinked structure and a surfactant (B) and is used after chemical mechanical polishing. The cleaning method of a semiconductor substrate is a method for cleaning semiconductor substrate given after chemical mechanical polishing, by the use of the cleaning composition. The process for manufacturing a semiconductor device including a step of chemically and mechanically polishing a semiconductor substrate and a step of cleaning the semiconductor substrate obtained after the chemical mechanical polishing, by the cleaning method.