Invention Application
- Patent Title: Wire sawing apparatus and wire sawing method
- Patent Title (中): 线锯设备和线锯法
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Application No.: US10985743Application Date: 2004-11-10
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Publication No.: US20050183713A1Publication Date: 2005-08-25
- Inventor: Yukihisa Takeuchi , Hiroyuki Tsuji , Kazumasa Kitamura , Masashi Watanabe
- Applicant: Yukihisa Takeuchi , Hiroyuki Tsuji , Kazumasa Kitamura , Masashi Watanabe
- Applicant Address: JP Nagoya-City
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya-City
- Main IPC: B24B27/06
- IPC: B24B27/06 ; B28D5/04 ; B28D1/08

Abstract:
A wire sawing apparatus includes a wire, a wire feed roller, and two basic rollers. The three rollers have the same diameter and are arranged in such a manner that their axes of rotation are in parallel with one another. Cutting-positioning circumferential grooves are formed on the two basic rollers at axially paired same positions. Intermediate circumferential grooves are formed on the wire feed roller and arranged in the axial direction such that the axial position of each intermediate circumferential groove corresponds to an axially central position between two adjacent pairs of cutting-positioning circumferential grooves. The wire is spirally wound a plurality of turns on the three rollers while being fitted into the circumferential grooves.
Public/Granted literature
- US07082940B2 Wire sawing apparatus and wire sawing method Public/Granted day:2006-08-01
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