发明申请
- 专利标题： Modular semiconductor workpiece processing tool
- 专利标题（中）： 模块化半导体工件加工工具
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申请号： US11101834申请日： 2005-04-07
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公开(公告)号： US20050193537A1公开(公告)日： 2005-09-08
- 发明人: Robert Berner , Daniel Woodruff , Wayne Schmidt , Kevin Coyle , Vladimir Zila , Worm Lund
- 申请人： Robert Berner , Daniel Woodruff , Wayne Schmidt , Kevin Coyle , Vladimir Zila , Worm Lund
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; B65G49/07 ; C25D7/12 ; H01L21/00 ; B21F41/00
摘要：
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
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IPC分类:
