公开(公告)号：US20050193537A1

公开(公告)日：2005-09-08

申请号：US11101834

申请日：2005-04-07

申请人： Robert Berner ,  Daniel Woodruff ,  Wayne Schmidt ,  Kevin Coyle ,  Vladimir Zila ,  Worm Lund

发明人： Robert Berner ,  Daniel Woodruff ,  Wayne Schmidt ,  Kevin Coyle ,  Vladimir Zila ,  Worm Lund

IPC分类号： H01L21/677 ,  B65G49/07 ,  C25D7/12 ,  H01L21/00 ,  B21F41/00

CPC分类号： H01L21/67173 ,  C25D7/12 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  Y10S414/141 ,  Y10T29/40

摘要： The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

摘要翻译： 本发明提供一种用于在其中处理半导体工件的半导体工件加工工具和方法。 半导体工件加工工具优选地包括包括至少一个接口模块的接口部分和包括用于处理半导体工件的多个处理模块的处理部分。 半导体工件加工工具可以具有用于在接口模块和处理模块之间传送半导体工件的传送器。

公开(公告)号：US06203582B1

公开(公告)日：2001-03-20

申请号：US08680068

申请日：1996-07-15

申请人： Robert W. Berner ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle ,  Vladimir Zila ,  Worm Lund

发明人： Robert W. Berner ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle ,  Vladimir Zila ,  Worm Lund

IPC分类号： H01L2100

CPC分类号： H01L21/67173 ,  C25D7/12 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  Y10S414/141 ,  Y10T29/40 ,  Y10T29/41

摘要： The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

摘要翻译： 本发明提供一种半导体工件加工工具。 半导体工件加工工具包括一个接口部分，该接口部分包括至少一个接口模块和一个包括用于处理半导体工件的多个处理模块的处理部分。 半导体工件加工工具具有用于在接口模块和处理模块之间传送半导体工件的输送机。

公开(公告)号：US06440178B1

公开(公告)日：2002-08-27

申请号：US09810192

申请日：2001-03-16

申请人： Robert W. Berner ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle ,  Vladimir Zila ,  Worm Lund

发明人： Robert W. Berner ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle ,  Vladimir Zila ,  Worm Lund

IPC分类号： H01L2100

摘要： The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

公开(公告)号：US07074246B2

公开(公告)日：2006-07-11

申请号：US10157762

申请日：2002-05-28

申请人： Robert W. Berner ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle ,  Vladimir Zila ,  Worm Lund

发明人： Robert W. Berner ,  Daniel J. Woodruff ,  Wayne J. Schmidt ,  Kevin W. Coyle ,  Vladimir Zila ,  Worm Lund

IPC分类号： H01L21/00 ,  H01L21/64

CPC分类号： H01L21/67173 ,  C25D7/12 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  Y10S414/141 ,  Y10T29/40 ,  Y10T29/41

摘要： The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

公开(公告)号：US20050189213A1

公开(公告)日：2005-09-01

申请号：US11085908

申请日：2005-03-21

申请人： Daniel Woodruff ,  Kyle Hanson ,  Thomas Oberlitner ,  LinLin Chen ,  John Pedersen ,  Vladimir Zila

发明人： Daniel Woodruff ,  Kyle Hanson ,  Thomas Oberlitner ,  LinLin Chen ,  John Pedersen ,  Vladimir Zila

IPC分类号： C23C18/16 ,  A61K35/12 ,  C23C28/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/06 ,  H01L21/288 ,  C25D17/04

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06645356B1

公开(公告)日：2003-11-11

申请号：US09386558

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

公开(公告)号：US06699373B2

公开(公告)日：2004-03-02

申请号：US09944152

申请日：2001-08-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： H01L21/68721 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68785

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06309524B1

公开(公告)日：2001-10-30

申请号：US09386610

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1704

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith. The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头对工件的表面执行擦拭动作。 接触组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US20110213480A1

公开(公告)日：2011-09-01

申请号：US12715033

申请日：2010-03-01

申请人： Vladimir Zila ,  Zuzana Zila ,  Christopher Adam Sinclair ,  Jason Joseph Manuel

发明人： Vladimir Zila ,  Zuzana Zila ,  Christopher Adam Sinclair ,  Jason Joseph Manuel

IPC分类号： G06F17/50 ,  G06N5/02

CPC分类号： G06F17/5004 ,  G06F2217/02

摘要： A generic, integrated, parametric, automated product configuration system for parametric configuration of products such as offices on a building space plan. The system can produce bills of materials, costings and manufacturing drawings in real-time at the request of a user as the user specifies and configures the product components and parameters values. The system provides for real time three-dimensional visualization and editing of the product as it is configured. It also includes a rule engine for validating the product and automatically incorporating missing necessary components in a configuration in real-time as the user configures a product.

摘要翻译： 一种通用的，集成的，参数化的自动化产品配置系统，用于参数化配置产品，如建筑空间计划中的办公室。 当用户指定和配置产品组件和参数值时，系统可以根据用户的要求实时生成物料清单，成本计算和制造图纸。 该系统在配置时提供产品的实时三维可视化和编辑。 它还包括用于验证产品的规则引擎，并在用户配置产品时自动将配置中的缺少的必需组件并入配置中。

公开(公告)号：US06091498A

公开(公告)日：2000-07-18

申请号：US991062

申请日：1997-12-15

申请人： Kyle Hanson ,  Mark Dix ,  Vladimir Zila ,  Daniel J. Woodruff

发明人： Kyle Hanson ,  Mark Dix ,  Vladimir Zila ,  Daniel J. Woodruff

IPC分类号： B65G49/07 ,  B25J9/06 ,  C25D7/12 ,  H01L21/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  G01B11/14 ,  G01N21/00

CPC分类号： H01L21/67259 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67769 ,  H01L21/67781

摘要： A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide/actuator comprising a fixed frame and a movable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the movable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

摘要翻译： 阐述了用于半导体晶片处理装置的提升/倾斜组件。 提升/倾斜组件包括具有固定框架和可移动框架的线性导向/致动器。 用于接收多个半导体晶片的嵌套可旋转地连接到可移动框架。 当它由与可线性方式耦合的电动机用可移动框架驱动时，嵌套在晶片水平取向和晶片垂直取向之间旋转。 当嵌套处于晶片垂直方向时，连接到嵌套的杠杆提供与巢的真垂直的偏移。