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30 条记录 (耗时 0.019 秒)

    SINGLE SIDE WORKPIECE PROCESSING
    1.
    发明申请
    SINGLE SIDE WORKPIECE PROCESSING 审中-公开
    单面工件加工

    公开(公告)号：US20070110895A1

    公开(公告)日：2007-05-17

    申请号：US11619515

    申请日：2007-01-03

    申请人： Jason Rye ,  Daniel Woodruff ,  Dana Scranton

    发明人： Jason Rye ,  Daniel Woodruff ,  Dana Scranton

    IPC分类号： B05C11/02 ,  B05D3/12 ,  C23C16/00 ,  B05B1/28

    CPC分类号： H01L21/6723 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/68792

    摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.

    摘要翻译： 用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。 头包括具有气体系统的转子。 气体从转子中的入口喷射或喷射以产生旋转气流。 旋转气流引起压力条件，其保持工件的第一侧的边缘抵抗转子上的接触销。 转子和工件一起旋转。 与周边相邻的导销可能有助于将工件与转子对准。 有角度的表面有助于将废工艺液体偏离工件。 头部可以与碗一起移动到多个不同的接合位置。 当工件旋转时，碗中的喷嘴将工艺液体喷射到工件的第二面上，以处理工件。 可以使用移动端点检测器来检测处理的终点。

    Electroplating apparatus with segmented anode array
    4.
    发明申请
    Electroplating apparatus with segmented anode array 审中-公开

    公开(公告)号：US20050161336A1

    公开(公告)日：2005-07-28

    申请号：US11083439

    申请日：2005-03-17

    申请人： Daniel Woodruff ,  Kyle Hanson

    发明人： Daniel Woodruff ,  Kyle Hanson

    IPC分类号： C25D7/12 ,  C25D17/12 ,  C25D5/02 ,  C25D17/00

    CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

    摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

    Electroplating apparatus with segmented anode array
    5.
    发明申请
    Electroplating apparatus with segmented anode array 审中-公开

    公开(公告)号：US20050161320A1

    公开(公告)日：2005-07-28

    申请号：US11083707

    申请日：2005-03-17

    申请人： Daniel Woodruff ,  Kyle Hanson

    发明人： Daniel Woodruff ,  Kyle Hanson

    IPC分类号： C25D7/12 ,  C25D17/12 ,  C25D17/00

    CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

    摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

    Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems
    6.
    发明申请
    Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems 有权
    集成工具，可互换的湿加工部件，用于加工微型工件和自动校准系统

    公开(公告)号：US20050034809A1

    公开(公告)日：2005-02-17

    申请号：US10861240

    申请日：2004-06-03

    申请人： Daniel Woodruff ,  Jeffry Davis ,  Randy Harris ,  David Mattson ,  James Erickson ,  Matthew Egloff

    发明人： Daniel Woodruff ,  Jeffry Davis ,  Randy Harris ,  David Mattson ,  James Erickson ,  Matthew Egloff

    IPC分类号： B24B20060101 ,  C12N15/31 ,  C23F1/00 ,  H01L21/00

    CPC分类号： H01L21/6719

    摘要： An integrated tool and automatic calibration systems that enable wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the down time associated with repairing or maintaining processing chambers and/or lift-rotate units so that the tools can maintain a high throughput. Several aspects of these tools are particularly useful for applications that have stringent performance requirements because components are more likely to require maintenance more frequently, and reducing the down time associated with maintaining such components will significantly enhance the integrated tool.

    摘要翻译： 集成的工具和自动校准系统，使湿化学处理室，提升 - 旋转单元和其他硬件能够快速互换，而无需重新校准运输系统或其他组件到更换项目。 预计这些工具可以减少与修理或维护处理室和/或提升旋转单元相关联的停机时间，从而使工具能够保持高通量。 这些工具的几个方面对于具有严格性能要求的应用程序特别有用，因为组件更有可能需要更频繁的维护，并且减少与维护这些组件相关联的停机时间将显着增强集成工具。

    SINGLE SIDE WORKPIECE PROCESSING
    8.
    发明申请
    SINGLE SIDE WORKPIECE PROCESSING 有权
    单面工件加工

    公开(公告)号：US20080011334A1

    公开(公告)日：2008-01-17

    申请号：US11782159

    申请日：2007-07-24

    申请人： Jason Rye ,  Kyle Hanson ,  Daniel Woodruff

    发明人： Jason Rye ,  Kyle Hanson ,  Daniel Woodruff

    IPC分类号： B08B3/08

    CPC分类号： H01L21/68735 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67259 ,  H01L21/68728 ,  H01L21/68785 ,  H01L21/68792

    摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.

    摘要翻译： 用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。 头包括具有气体系统的转子。 气体或空气从转子中的入口喷射或喷射以产生旋转气体流。 旋转气流导致压力条件，其将工件的第一侧的边缘抵靠在转子上的成角度的环形表面上。 转子和工件一起旋转。 与周边相邻的导销可能有助于将工件与转子对准。 通过转子的出口允许气体流出转子。

    Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
    9.
    发明申请
    Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces 有权
    微型工件湿化学处理液体搅拌装置及方法

    公开(公告)号：US20070151844A1

    公开(公告)日：2007-07-05

    申请号：US11603940

    申请日：2006-11-22

    申请人： Gregory Wilson ,  Paul McHugh ,  Daniel Woodruff

    发明人： Gregory Wilson ,  Paul McHugh ,  Daniel Woodruff

    IPC分类号： C25B9/04

    CPC分类号： C25D17/00 ,  C25D5/08 ,  C25D5/18 ,  C25D17/001 ,  C25D17/08 ,  C25D17/10

    摘要： Reactors with agitators and methods for processing microfeature workpieces with such reactors. The agitators are capable of obtaining high, controlled mass-transfer rates that result in high quality surfaces and efficient wet chemical processes. The agitators generate high flow velocities in the fluid and contain the high energy fluid proximate to the surface of the workpiece to form high quality surfaces when cleaning, etching and/or depositing materials to/from a workpiece. The agitators also have short stroke lengths so that the footprints of the reactors are relatively small. As a result, the reactors are efficient and cost effective to operate. The agitators are also designed so that electrical fields in the processing solution can effectively operate at the surface of the workpiece.

    摘要翻译： 具有搅拌器的反应器和用这种反应器处理微型工件的方法。 搅拌器能够获得高质量的质量传递速率，从而产生高品质的表面和有效的湿化学工艺。 搅拌器在流体中产生高流速并且在工件表面附近容纳高能量流体，以便当清洁，蚀刻和/或从工件沉积材料时形成高质量的表面。 搅拌器还具有短行程长度，使得反应器的足迹相对较小。 因此，反应堆的运行效率高，成本低。 搅拌器也被设计成使得处理溶液中的电场能够在工件的表面上有效地操作。

    Adaptable electrochemical processing chamber
    10.
    发明申请
    Adaptable electrochemical processing chamber 审中-公开
    适应电化学处理室

    公开(公告)号：US20050155864A1

    公开(公告)日：2005-07-21

    申请号：US11081030

    申请日：2005-03-10

    申请人： Daniel Woodruff ,  Kyle Hanson ,  Steve Eudy ,  Curtis Weber ,  Randy Harris

    发明人： Daniel Woodruff ,  Kyle Hanson ,  Steve Eudy ,  Curtis Weber ,  Randy Harris

    IPC分类号： B23H7/26 ,  C25D3/00 ,  C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D21/00

    CPC分类号： H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  H01L21/6719 ,  H01L21/67751

    摘要： An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.

    摘要翻译： 一种电化学处理室，可用于处理不同的工件和改性电化学处理室的方法。 在一个特定实施例中，电化学处理室200包括限定多个电极隔室520的多个壁510，每个电极室中具有至少一个电极600，以及限定多个流动管道的虚拟电极单元530， 至少一个流动管道与每个电极隔室流体连通。 第一虚拟电极单元530可以被替换为第二虚拟电极单元540，而不改变任何电极600，以使处理室200适应于处理不同的工件。