发明申请
- 专利标题： Resin coating method and apparatus
- 专利标题（中）： 树脂涂布方法和装置
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申请号： US11117308申请日： 2005-04-29
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公开(公告)号： US20050196703A1公开(公告)日： 2005-09-08
- 发明人: Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
- 申请人： Shunji Baba , Takatoyo Yamakami , Norio Kainuma , Kenji Kobae , Hidehiko Kira , Hiroshi Kobayashi
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LTD.
- 当前专利权人： FUJITSU LTD.
- 当前专利权人地址： JP Kawasaki
- 优先权： JP2000-293013 20000926
- 主分类号： G03F7/16
- IPC分类号： G03F7/16 ; B05C5/02 ; B05C11/10 ; B05D3/00 ; B05D7/00 ; H01L21/56 ; H01L21/60 ; H05K1/02 ; H05K3/00 ; H05K3/28 ; G03C1/725
摘要：
A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.
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