发明申请
- 专利标题： Flexible substrate, Multilayer flexible substrate and process for producing the same
- 专利标题（中）： 柔性基板，多层柔性基板及其制造方法
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申请号： US11079316申请日： 2005-03-15
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公开(公告)号： US20050205294A1公开(公告)日： 2005-09-22
- 发明人: Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
- 申请人： Yoshihisa Yamashita , Toshio Fujii , Seiichi Nakatani , Takashi Ichiryu , Satoru Tomekawa , Hiroki Yabe
- 优先权： JPP2004-079847 20040319
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K1/16 ; H05K3/20 ; H05K3/38 ; H05K3/40 ; H05K3/42 ; H05K3/46
摘要：
A flexible substrate comprising: (i) a film; (ii) an insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (iv) a via which is located between a front-sided wiring pattern and a rear-sided wiring pattern and serves to electrically connect between said front-sided wiring pattern and said rear-sided wiring pattern; wherein said insulating resin layer formed on each of said front face and said rear face of the said film is thicker than said film.
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