公开(公告)号：US07531754B2

公开(公告)日：2009-05-12

申请号：US11712943

申请日：2007-03-02

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H05K1/00

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。

公开(公告)号：US20080210458A1

公开(公告)日：2008-09-04

申请号：US11976848

申请日：2007-10-29

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/03

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate comprises: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。

公开(公告)号：US20070151756A1

公开(公告)日：2007-07-05

申请号：US11712943

申请日：2007-03-02

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H05K1/16

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

公开(公告)号：US07773386B2

公开(公告)日：2010-08-10

申请号：US11976848

申请日：2007-10-29

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/00

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。

公开(公告)号：US07205483B2

公开(公告)日：2007-04-17

申请号：US11079371

申请日：2005-03-15

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H05K1/11

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

摘要翻译： 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。

公开(公告)号：US07321496B2

公开(公告)日：2008-01-22

申请号：US11079316

申请日：2005-03-15

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：膜; 形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; 嵌入到形成在膜的前表面上的绝缘树脂层中的前侧布线图案和嵌入在形成在膜的背面上的绝缘树脂层中的背面布线图案; 以及位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个正面上的绝缘树脂层 薄膜的表面和背面比薄膜厚。

公开(公告)号：US20050205294A1

公开(公告)日：2005-09-22

申请号：US11079316

申请日：2005-03-15

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate comprising: (i) a film; (ii) an insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (iv) a via which is located between a front-sided wiring pattern and a rear-sided wiring pattern and serves to electrically connect between said front-sided wiring pattern and said rear-sided wiring pattern; wherein said insulating resin layer formed on each of said front face and said rear face of the said film is thicker than said film.

摘要翻译： 一种柔性基板，包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的与所述前表面相对的表面的每一个上的绝缘树脂层; （iii）嵌入在所述膜的所述前表面上形成的绝缘树脂层中的前侧布线图案和嵌入在所述膜的所述背面上形成的绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于电连接在所述前侧布线图案和所述背面布线图案之间; 其中形成在所述膜的所述前表面和所述后表面的每一个上的所述绝缘树脂层比所述膜厚。

公开(公告)号：US20050205291A1

公开(公告)日：2005-09-22

申请号：US11079371

申请日：2005-03-15

申请人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

发明人： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC分类号： H01L21/60 ,  H05K1/00 ,  H05K1/11 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

摘要： A process for producing a flexible substrate comprising of a film, an insulating resin layer, and a wiring pattern, said process comprising the steps of: (a) preparing a sheet member comprising, (i) the film, (ii) the insulating resin layer formed on each of a front face of said film and a rear face of said film which face is opposite to said front face, and (iii) a front-sided wiring pattern embedded in said insulating resin layer formed on said front face of said film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on said rear face of said film; and (b) pressing a part of at least one of said front-sided wiring pattern and said rear-sided wiring pattern into the inside of said sheet member so that a part of said front-sided wiring pattern and a part of said rear-sided wiring pattern are jointed to each other to form a junction.

摘要翻译： 一种制造柔性基材的方法，包括膜，绝缘树脂层和布线图案，所述方法包括以下步骤：（a）制备片状部件，其包括：（i）膜，（ii）绝缘树脂 所述膜的前表面上形成的层和所述膜的与所述前表面相对的背面，以及（iii）嵌入在所述绝缘树脂层的所述前表面上形成的所述绝缘树脂层中的前侧布线图案 膜和嵌入在形成在所述膜的所述背面上的绝缘树脂层中的背面布线图案; 和（b）将所述前侧布线图案和所述背面布线图案中的至少一个的一部分压入所述片状构件的内部，使得所述前侧布线图案的一部分和所述背面布线图案的一部分， 双面布线图案彼此连接以形成结。

公开(公告)号：US08283246B2

公开(公告)日：2012-10-09

申请号：US13091801

申请日：2011-04-21

申请人： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima ,  Yoshihisa Yamashita ,  Takashi Ichiryu

发明人： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima ,  Yoshihisa Yamashita ,  Takashi Ichiryu

IPC分类号： H01L21/00

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29299 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0264 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0675 ,  H01L2924/0695 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention involves mounting a solder resin composition (6) including a solder powder (5a) and a resin (4) on the first electronic component (2); arranging such that the connecting terminals (3) of the first electronic component (2) and the electrode terminals (7) of the second electronic component (8) are facing each other; ejecting a gas (9a) from a gas generation source (1) included in the first electronic component (2) by heating the first electronic component (2) and the solder resin composition; and inducing the flow of the solder powder (5a) in the solder resin composition (6) by inducing convection of the gas (9a) in the solder resin composition (6), and electrically connecting the connecting terminals (3) and the electrode terminals (7) by self-assembly on the connecting terminals (3) and the electrode terminals (7). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.

摘要翻译： 本发明涉及将包含焊料粉末（5a）和树脂（4）的焊料树脂组合物（6）安装在第一电子部件（2）上; 排列成使得第一电子部件（2）的连接端子（3）和第二电子部件（8）的电极端子（7）彼此面对; 通过加热第一电子部件（2）和焊料树脂组合物，从包括在第一电子部件（2）中的气体发生源（1）喷出气体（9a） 并且通过引起焊料树脂组合物（6）中的气体（9a）的对流而引起焊料粉末（5a）在焊料树脂组合物（6）中的流动，并将连接端子（3）和电极端子 （7）通过在连接端子（3）和电极端子（7）上的自组装。 通过这种方式提供了一种倒装芯片封装方法，其以高连接可靠性连接具有窄间距的半导体芯片的电极端子和电路板的连接端子，以及用于封装在电路板上的凸块形成方法。

公开(公告)号：US20110049598A1

公开(公告)日：2011-03-03

申请号：US12939729

申请日：2010-11-04

申请人： Koichi HIRANO ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita ,  Takashi Ichiryu

发明人： Koichi HIRANO ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita ,  Takashi Ichiryu

IPC分类号： H01L29/786

CPC分类号： H01L51/0024 ,  H01L29/41733 ,  H01L29/66742 ,  H01L29/78603 ,  H01L51/0023 ,  H01L51/0097 ,  H01L51/0525 ,  H01L51/055 ,  H01L51/102 ,  Y10T428/24917

摘要： A layered film of a three-layer clad foil formed with a first metal layer 23, a second metal layer 25, and an inorganic insulating layer 35 interposed therebetween is prepared. After the second metal layer 25 is partially etched to form a gate electrode 20g, the first metal layer 23 is partially etched to form source/drain electrodes 20s, 20d in a region corresponding to the gate electrode 20g. A semiconductor layer 40 is then formed in contact with the source/drain electrodes 20s, 20d and on the gate electrode 20g with the inorganic insulating layer 35 interposed therebetween. The inorganic insulating layer 35 on the gate electrode 20g functions as a gate insulating film 30, and the semiconductor layer 40 between the source/drain electrodes 20s, 20d on the inorganic insulating layer 35 functions as a channel.

摘要翻译： 制备形成有第一金属层23，第二金属层25和介于其间的无机绝缘层35的三层复合箔的分层膜。 在第二金属层25被部分蚀刻以形成栅电极20g之后，第一金属层23被部分蚀刻以在对应于栅电极20g的区域中形成源/漏电极20s，20d。 然后，将半导体层40形成为与源极/漏极20s，20d接触并且在栅极电极20g上形成有绝缘层35。 栅电极20g上的无机绝缘层35用作栅极绝缘膜30，无机绝缘层35上的源/漏电极20s，20d之间的半导体层40用作沟道。