发明申请
- 专利标题： Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing same
- 专利标题（中）： 用于电子电路的导热塑料基板及其制造方法
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申请号： US11129121申请日： 2005-05-13
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公开(公告)号： US20050209383A1公开(公告)日： 2005-09-22
- 发明人: James Miller , E. Sagal , Kevin McCullough
- 申请人： James Miller , E. Sagal , Kevin McCullough
- 主分类号： B29C45/00
- IPC分类号： B29C45/00 ; C08K3/22 ; C08K3/28 ; C08K3/38 ; H05K1/03 ; C08K3/40
摘要：
A thermally-conductive plastic substrate for supporting electronic circuits is provided. The substrate has a relatively low dielectric constant and good mechanical strength. The substrate is made from a polymer composition comprising a base polymer matrix and a thermally-conductive, electrically-insulating material. The composition can comprise polyphenylene sulfide and boron nitride. The composition can further comprise a reinforcing material such as glass. The invention also encompasses methods for making such substrates.
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