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    Polymer electronic device package having high thermal conductivity and dielectric strength
    2.
    发明申请
    Polymer electronic device package having high thermal conductivity and dielectric strength 失效
    具有高导热性和介电强度的聚合物电子器件封装

    公开(公告)号：US20050189523A1

    公开(公告)日：2005-09-01

    申请号：US11118057

    申请日：2005-04-29

    申请人： E. Sagal ,  Kevin McCullough ,  James Miller

    发明人： E. Sagal ,  Kevin McCullough ,  James Miller

    IPC分类号： C08K3/22 ,  C08K3/28 ,  H01B3/30 ,  H01B1/00

    CPC分类号： C08K3/22 ,  C08K3/28 ,  H01B3/30 ,  H01B3/301

    摘要： A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

    摘要翻译： 提供了具有高导热性和介电强度的聚合物组合物。 聚合物组合物包含基础聚合物基质和导热的电绝缘材料。 可以在组合物中添加玻璃等增强材料。 聚合物组合物可以模制成用于诸如电容器，晶体管和电阻器的电子器件的包装组件。

    Thermally conductive electronic connector having molded housing
    5.
    发明申请
    Thermally conductive electronic connector having molded housing 有权
    具有模制外壳的导热电子连接器

    公开(公告)号：US20050095901A1

    公开(公告)日：2005-05-05

    申请号：US11011996

    申请日：2004-12-14

    申请人： James Miller ,  E. Sagal ,  Kevin McCullough

    发明人： James Miller ,  E. Sagal ,  Kevin McCullough

    IPC分类号： G02B6/38 ,  G02B6/42 ,  H05K7/20 ,  H05K9/00 ,  H01R13/00

    CPC分类号： H05K9/0083 ,  G02B6/3814 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4272 ,  G02B6/4277 ,  G02B6/4284 ,  H05K7/20

    摘要： An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.

    摘要翻译： 提供一种电子连接器，其具有包含具有诸如光电二极管或激光器之类的发热部件的电路板的壳体。 外壳在电路板和发热部件上模制。 壳体由含有基础聚合物和导热填料的可模制的导热聚合物组合物制成。 可以使用液晶聚合物作为基础聚合物，可以使用氮化硼颗粒和碳纤维作为导热填料。 在一个实施方案中，导热聚合物组合物包含30至60％的基础聚合物，25％至50％的第一导热填料材料和10至25％的第二导热填料材料。 模制外壳能够散发来自发热部件的热量。 还提供了制造电子连接器的方法。