发明申请
- 专利标题： Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
- 专利标题（中）： 硬化组合物，硬化产品，其制造方法和用硬化产品密封的发光二极管
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申请号： US10512135申请日： 2003-04-23
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公开(公告)号： US20050209400A1公开(公告)日： 2005-09-22
- 发明人: Manabu Tsumura , Masahito Ide , Katsuya Ouchi , Masufumi Kuramoto , Tomohide Miki , Ikuya Nii
- 申请人： Manabu Tsumura , Masahito Ide , Katsuya Ouchi , Masufumi Kuramoto , Tomohide Miki , Ikuya Nii
- 优先权： JP2002-12947 20020426
- 国际申请： PCT/JP03/05142 WO 20030423
- 主分类号： C08F8/00
- IPC分类号： C08F8/00 ; C08F8/42 ; C08G77/42 ; C08G77/50 ; C08G77/54 ; C08K5/54 ; C08L63/00 ; C08L83/00 ; C08L83/05 ; C08L83/10 ; C08L83/14 ; H01L33/56
摘要：
The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.