利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.018 秒)

    Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
    1.
    发明申请
    Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device 有权

    公开(公告)号：US20060243947A1

    公开(公告)日：2006-11-02

    申请号：US10546905

    申请日：2004-02-25

    申请人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

    发明人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

    IPC分类号： C09K19/52

    CPC分类号： C08G77/452 ,  C08F283/00 ,  C08F290/06 ,  C08F290/14 ,  C08G77/485 ,  C08G77/54 ,  C08K3/22 ,  C08L51/003 ,  C08L53/00 ,  C08L83/04 ,  C08L101/00 ,  H01L23/295 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/31663 ,  Y10T428/31786 ,  C08L2666/02 ,  H01L2924/00

    摘要： The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100° C. for 1 hour, the flow-out distance is not longer than 2 cm; A light-shielding paste which comprises the above curable composition; or, A method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls and formed of a molding resin by a monolithic process with the respective ends of an external positive electrode and an external negative electrode being exposed at a predetermined distance on the aperture bottom which method comprises (1) applying a light-shielding paste to a substrate; (2) bringing the LED package aperture into close contact therewith; and (3) heating the LED package with the aperture facing upward; and thereby the light-shielding paste is allowed to spread along the package sidewalls alone. The curable composition of the invention is excellent in light-shielding ability and is highly resistant to light and, therefore, can be used as a light-shielding paste. Further, the curable composition of the invention is low in fluidity and, therefore, light-emitting diodes with the curing product formed on the LED package sidewalls alone can be obtained by using that curable composition. Furthermore, according to the method of light-shielding resin layer formation according to the invention, it is possible to efficiently apply a light-shielding paste to the LED package sidewalls alone for light-shielding resin layer formation, whereby the productivity is markedly improved.

    Curable composition and process for producing molded articles using the same
    2.
    发明授权
    Curable composition and process for producing molded articles using the same 失效
    可固化组合物及其制备方法

    公开(公告)号：US5623030A

    公开(公告)日：1997-04-22

    申请号：US564593

    申请日：1995-11-29

    申请人： Manabu Tsumura ,  Masafumi Hiraishi ,  Takahisa Iwahara ,  Toshifumi Hirose

    发明人： Manabu Tsumura ,  Masafumi Hiraishi ,  Takahisa Iwahara ,  Toshifumi Hirose

    IPC分类号： C08G77/50 ,  C08G77/52 ,  C08L83/04 ,  C08F283/00

    CPC分类号： C08G77/52 ,  C08G77/50 ,  C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08G77/70

    摘要： A curable composition providing a cured product having a silicon type interpenetrating polymer network, which comprises (A) a silsesquioxane ladder polymer, (B) a silicon compound having at least two SiH groups per molecule, (C) a silicon compound having at least two vinylsilyl groups per molecule and (D) a neutral platinum catalyst; and a process for producing a molded article comprising heating the curable composition under a controlled temperature for synchronously causing hydrolysis and condensation of the alkoxysilyl group and/or silanol group and hydrosilylation.

    摘要翻译： 提供具有硅型互穿聚合物网络的固化产物的可固化组合物，其包含（A）倍半硅氧烷梯度聚合物，（B）每分子具有至少两个SiH基团的硅化合物，（C）具有至少两个 乙烯基甲硅烷基和（D）中性铂催化剂; 以及生产模制品的方法，包括在受控温度下加热可固化组合物，以同时引起烷氧基甲硅烷基和/或硅烷醇基团的水解和缩合以及氢化硅烷化。

    Curable composition, composition for optical material, optical material, liquid-crystal display device, transparent conductive film, and process for producing the same
    7.
    发明授权
    Curable composition, composition for optical material, optical material, liquid-crystal display device, transparent conductive film, and process for producing the same 有权
    可固化组合物，光学材料组合物，光学材料，液晶显示装置，透明导电膜及其制造方法

    公开(公告)号：US07470457B2

    公开(公告)日：2008-12-30

    申请号：US10239777

    申请日：2001-04-20

    申请人： Manabu Tsumura ,  Katsuya Ouchi ,  Kazunori Yokoyama

    发明人： Manabu Tsumura ,  Katsuya Ouchi ,  Kazunori Yokoyama

    IPC分类号： G02F1/1333

    CPC分类号： G02F1/13439 ,  C08G77/50 ,  G02B1/04 ,  G02F1/1333 ,  G02F1/133305 ,  Y10T428/1068 ,  Y10T428/1086 ,  C08L83/04 ,  C08L83/14

    摘要： A curable composition comprising: component (A), which is an aliphatic organic compound including at least two carbon-carbon double bonds within one molecule, the at least two carbon-carbon double bonds having reactivity with an SiH group; component (B), which is a compound including at least two SiH groups within one molecule; and component (C), which is a hydrosilylation catalyst. The curable composition can be made into an optical material by being previously mixed so as to allow the carbon-carbon double bonds having reactivity with an SiH group to react with some or all of the SiH groups in the composition, thereby causing curing. There is provided a curable composition having a high heat-resistance, a low birefringence, a small coefficient of photoelasticity, a high optical transparency, and toughness; an optical material; a method for producing the same; and a liquid crystal display device incorporating the same.

    摘要翻译： 一种可固化组合物，其包含：组分（A），其是在一分子内包含至少两个碳 - 碳双键的脂族有机化合物，所述至少两个碳 - 碳双键与SiH基具有反应性; 组分（B），其是在一个分子内包含至少两个SiH基团的化合物; 和组分（C），其为氢化硅烷化催化剂。 可以通过预先混合使可固化组合物制成光学材料，以使具有与SiH基反应性的碳 - 碳双键与组合物中的一些或全部SiH基团反应，从而引起固化。 提供了耐热性高，双折射低，光弹性系数小，光学透明性高，韧性高的固化性组合物。 光学材料; 其制造方法; 以及包含该液晶显示装置的液晶显示装置。