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23 条记录 (耗时 0.029 秒)

    Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
    3.
    发明申请
    Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device 有权

    公开(公告)号：US20060243947A1

    公开(公告)日：2006-11-02

    申请号：US10546905

    申请日：2004-02-25

    申请人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

    发明人： Manabu Tsumura ,  Masahito Ide ,  Katsuya Ouchi ,  Masafumi Kuramoto ,  Tomohide Miki

    IPC分类号： C09K19/52

    CPC分类号： C08G77/452 ,  C08F283/00 ,  C08F290/06 ,  C08F290/14 ,  C08G77/485 ,  C08G77/54 ,  C08K3/22 ,  C08L51/003 ,  C08L53/00 ,  C08L83/04 ,  C08L101/00 ,  H01L23/295 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/31663 ,  Y10T428/31786 ,  C08L2666/02 ,  H01L2924/00

    摘要： The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100° C. for 1 hour, the flow-out distance is not longer than 2 cm; A light-shielding paste which comprises the above curable composition; or, A method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls and formed of a molding resin by a monolithic process with the respective ends of an external positive electrode and an external negative electrode being exposed at a predetermined distance on the aperture bottom which method comprises (1) applying a light-shielding paste to a substrate; (2) bringing the LED package aperture into close contact therewith; and (3) heating the LED package with the aperture facing upward; and thereby the light-shielding paste is allowed to spread along the package sidewalls alone. The curable composition of the invention is excellent in light-shielding ability and is highly resistant to light and, therefore, can be used as a light-shielding paste. Further, the curable composition of the invention is low in fluidity and, therefore, light-emitting diodes with the curing product formed on the LED package sidewalls alone can be obtained by using that curable composition. Furthermore, according to the method of light-shielding resin layer formation according to the invention, it is possible to efficiently apply a light-shielding paste to the LED package sidewalls alone for light-shielding resin layer formation, whereby the productivity is markedly improved.

    Light emitting device and method of manufacturing the light emitting device
    6.
    发明授权
    Light emitting device and method of manufacturing the light emitting device 有权
    发光装置及其制造方法

    公开(公告)号：US08659106B2

    公开(公告)日：2014-02-25

    申请号：US13258316

    申请日：2010-10-28

    申请人： Shinji Nishijima ,  Tomohide Miki ,  Hiroto Tamaki

    发明人： Shinji Nishijima ,  Tomohide Miki ,  Hiroto Tamaki

    IPC分类号： H01L31/0203 ,  H01L23/495

    CPC分类号： H05K5/0091 ,  H01L33/486 ,  H01L33/52 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

    摘要翻译： 一种发光器件包括形成由底表面和侧壁限定的凹部的基体，其上表面露出在凹部中并且其下表面形成外表面的导电构件，设置在凹部中的突出部分， 安装在所述凹部中并电连接到所述导电构件的发光元件，以及设置在所述凹部中以覆盖所述发光元件的密封构件。 基体具有由树脂一体形成的底部部分和侧壁部分，侧壁部分的内表面是限定凹部的侧壁，并且具有弯曲部分，并且突出部分靠近 曲面。 通过这种布置，可以获得光提取效率和可靠性优异的薄型和小型发光装置。

    Light emitting device and backlight unit using the same
    7.
    发明授权
    Light emitting device and backlight unit using the same 有权
    发光装置和使用其的背光单元

    公开(公告)号：US08426879B2

    公开(公告)日：2013-04-23

    申请号：US11992670

    申请日：2006-09-29

    申请人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

    发明人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An object of the present invention is to provide a light emitting device that shows high adhesion between a sealing member and a package member. A light emitting device 100 of the present invention comprises a package 20 with a recess 60 having a bottom face 20a and a side wall 20b, a light emitting element 10 mounted on the bottom face 20a of the recess 60 of the package 20, and a sealing member 40 filled in the recess 60 of the package 20, with which the light emitting element 10 is coated, wherein the package 20 contains, against the entire monomer component, from 5 to 70% by weight of potassium titanate fibers and/or wollastonite, from 10 to 50% by weight of titanium oxide, and from 15 to 85% by weight of a semiaromatic polyamide containing 20 mol % or more of an aromatic monomer, a part of the side wall 20b of the recess 60 of the package 20 has a thickness of 100 μm or less, and the sealing member 40 is made of silicone.

    摘要翻译： 本发明的目的是提供一种在密封构件和包装构件之间显示高粘合性的发光装置。 本发明的发光器件100包括具有凹部60的封装20，该凹部60具有底面20a和侧壁20b，安装在封装20的凹部60的底面20a上的发光元件10和 密封构件40填充在包装20的凹部60中，发光元件10通过该凹部60被涂覆，其中包装20针对整个单体组分包含5至70重量％的钛酸钾纤维和/或硅灰石 ，10〜50重量％的二氧化钛，15〜85重量％的含有20摩尔％以上的芳香族单体的半芳族聚酰胺，包装体20的凹部60的一部分侧壁20b 厚度为100μm以下，密封部件40为硅树脂。

    Light emitting device provided with lens for controlling light distribution characteristic
    9.
    发明授权
    Light emitting device provided with lens for controlling light distribution characteristic 有权
    具有用于控制配光特性的透镜的发光装置

    公开(公告)号：US07710016B2

    公开(公告)日：2010-05-04

    申请号：US11356276

    申请日：2006-02-17

    申请人： Tomohide Miki ,  Kenji Takine ,  Ryohei Yamashita

    发明人： Tomohide Miki ,  Kenji Takine ,  Ryohei Yamashita

    IPC分类号： H01L27/15 ,  H01L33/00

    CPC分类号： H01L33/507 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The light emitting device comprises a substrate (2), a positive electrode (6) and a negative electrode (4) formed on the substrate (2), a light emitting diode (8) connected to the positive electrode (6) and the negative electrode (4), the transparent resin (12 and 14) that covers the light emitting diode (8), a fluorescent material (16) that absorbs at least part of light emitted by the light emitting diode (8) and converts it to light of longer wavelength, and the lens that changes the direction of light emission from the light emitting diode (8) and/or the fluorescent material (16). The resin (12 and 14) includes the fluorescent material (16) and is formed so as to constitute the lens of substantially semi-cylindrical shape, and the fluorescent material (16) included in the resin (12 and 14) is distributed with a higher concentration in a region near the surface of the light emitting diode (8) than in a region near the surface of the portion that constitutes the lens.

    摘要翻译： 发光装置包括：基板（2），形成在基板（2）上的正极（6）和负极（4）;与正极（6）连接的发光二极管（8） 电极（4），覆盖发光二极管（8）的透明树脂（12和14），吸收由发光二极管（8）发射的光的至少一部分并将其转换为光的荧光材料（16） 以及改变来自发光二极管（8）和/或荧光材料（16）的发光方向的透镜。 树脂（12和14）包括荧光材料（16）并且形成为构成大致半圆柱形状的透镜，并且包含在树脂（12和14）中的荧光材料（16）分布在 在发光二极管（8）的表面附近的区域中比在构成透镜的部分的表面附近的区域更高的浓度。

    Light Emitting Device and Backlight Unit Using the Same
    10.
    发明申请
    Light Emitting Device and Backlight Unit Using the Same 有权
    发光装置和使用其的背光单元

    公开(公告)号：US20090134411A1

    公开(公告)日：2009-05-28

    申请号：US11992670

    申请日：2006-09-29

    申请人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

    发明人： Motohisa Kitani ,  Hirofumi Ichikawa ,  Tomoya Tsukioka ,  Tomohide Miki ,  Masafumi Kuramoto

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An object of the present invention is to provide a light emitting device that shows high adhesion between a sealing member and a package member. A light emitting device 100 of the present invention comprises a package 20 with a recess 60 having a bottom face 20a and a side wall 20b, a light emitting element 10 mounted on the bottom face 20a of the recess 60 of the package 20, and a sealing member 40 filled in the recess 60 of the package 20, with which the light emitting element 10 is coated, wherein the package 20 contains, against the entire monomer component, from 5 to 70% by weight of potassium titanate fibers and/or wollastonite, from 10 to 50% by weight of titanium oxide, and from 15 to 85% by weight of a semiaromatic polyamide containing 20 mol % or more of an aromatic monomer, a part of the side wall 20b of the recess 60 of the package 20 has a thickness of 100 μm or less, and the sealing member 40 is made of silicone.

    摘要翻译： 本发明的目的是提供一种在密封构件和包装构件之间显示高粘合性的发光装置。 本发明的发光器件100包括具有凹部60的封装20，该凹部60具有底面20a和侧壁20b，安装在封装20的凹部60的底面20a上的发光元件10和 密封构件40填充在包装20的凹部60中，发光元件10通过该凹部60被涂覆，其中包装20针对整个单体组分包含5至70重量％的钛酸钾纤维和/或硅灰石 ，10〜50重量％的二氧化钛，15〜85重量％的含有20摩尔％以上的芳香族单体的半芳族聚酰胺，包装体20的凹部60的一部分侧壁20b 厚度为100μm以下，密封部件40为硅树脂。