发明申请
US20050211375A1 Method of manufacturing a semiconductor device 审中-公开
制造半导体器件的方法

Method of manufacturing a semiconductor device
摘要:
The invention relates to a method of manufacturing a semiconductor device comprising the step of removing a silicon and nitrogen containing material by means of wet etching with an aqueous solution comprising hydrofluoric acid in a low concentration, the aqueous solution being applied under elevated pressure to reach a temperature above 100° C.
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