发明申请
US20050242162A1 Method for attaching a porous metal layer to a metal substrate
审中-公开
将多孔金属层附着在金属基板上的方法
- 专利标题: Method for attaching a porous metal layer to a metal substrate
- 专利标题(中): 将多孔金属层附着在金属基板上的方法
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申请号: US11146571申请日: 2005-06-07
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公开(公告)号: US20050242162A1公开(公告)日: 2005-11-03
- 发明人: Dana Medlin , Steven Charlebois , William Clarke , Dirk Pletcher , Joel Scrafton , H. Shetty , Dale Swarts
- 申请人: Dana Medlin , Steven Charlebois , William Clarke , Dirk Pletcher , Joel Scrafton , H. Shetty , Dale Swarts
- 主分类号: A61L27/00
- IPC分类号: A61L27/00 ; A61F2/00 ; A61F2/28 ; A61F2/30 ; A61F2/34 ; A61F2/38 ; A61L27/04 ; A61L27/30 ; A61L27/56 ; B22F7/00 ; B22F7/06 ; B22F7/08 ; C23C26/00 ; B23K20/00
摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structured porous layer; providing a dense metal substrate; providing a binding mixture; applying the binding mixture to the exterior of the substrate; placing the porous layer against the substrate such that the binding mixture is disposed there between forming an assembly; and heat treating the assembly to metallurgically bond the porous layer to the substrate.
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