发明申请
US20050242162A1 Method for attaching a porous metal layer to a metal substrate 审中-公开
将多孔金属层附着在金属基板上的方法

Method for attaching a porous metal layer to a metal substrate
摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structured porous layer; providing a dense metal substrate; providing a binding mixture; applying the binding mixture to the exterior of the substrate; placing the porous layer against the substrate such that the binding mixture is disposed there between forming an assembly; and heat treating the assembly to metallurgically bond the porous layer to the substrate.
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