发明申请
- 专利标题： Electronic circuit package
- 专利标题（中）： 电子电路封装
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申请号： US11180733申请日： 2005-07-14
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公开(公告)号： US20050248017A1公开(公告)日： 2005-11-10
- 发明人: Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
- 申请人： Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
- 优先权： JP03-34038 19910228
- 主分类号： G06F1/18
- IPC分类号： G06F1/18 ; G06F3/00 ; G06F11/10 ; G06F11/22 ; G06F12/16 ; G06F15/78 ; G11C5/00 ; H01L23/495 ; H01L23/50 ; H01L23/538 ; H01L25/04 ; H01L25/065 ; H01L25/18
摘要：
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
公开/授权文献
- US07233534B2 Electronic circuit package 公开/授权日：2007-06-19
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