发明申请
US20050255326A1 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
失效
用于形成二氧化硅基涂膜的组合物,二氧化硅基涂膜及其制备方法和电子部件
- 专利标题: Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
- 专利标题(中): 用于形成二氧化硅基涂膜的组合物,二氧化硅基涂膜及其制备方法和电子部件
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申请号: US11040119申请日: 2005-01-24
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公开(公告)号: US20050255326A1公开(公告)日: 2005-11-17
- 发明人: Haruaki Sakurai , Koichi Abe , Kazuhiro Enomoto , Shigeru Nobe
- 申请人: Haruaki Sakurai , Koichi Abe , Kazuhiro Enomoto , Shigeru Nobe
- 申请人地址: JP Tokyo
- 专利权人: HITACHI CHEMICAL CO., LTD.
- 当前专利权人: HITACHI CHEMICAL CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JPP2002-052025 20020227; JPP2002-060615 20020306; JPP2002-060620 20020306; JPP2002-060622 20020306; JPP2002-127012 20020426
- 主分类号: B05D3/02
- IPC分类号: B05D3/02 ; B32B9/04 ; C08G77/08 ; C08K3/34 ; C09D183/02 ; C09D183/04 ; H01L23/532
摘要:
The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.
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