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    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
    2.
    发明申请
    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts 失效
    用于形成二氧化硅基涂膜的组合物，二氧化硅基涂膜及其制备方法和电子部件

    公开(公告)号：US20060052566A1

    公开(公告)日：2006-03-09

    申请号：US11207199

    申请日：2005-08-19

    申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    IPC分类号： C08L83/04 ,  B32B9/04

    CPC分类号： H01L23/5329 ,  C09D183/02 ,  C09D183/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

    摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

    摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
    5.
    发明授权
    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts 失效
    用于形成二氧化硅基涂膜的组合物，二氧化硅基涂膜及其制备方法和电子部件

    公开(公告)号：US07682701B2

    公开(公告)日：2010-03-23

    申请号：US11040119

    申请日：2005-01-24

    申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    IPC分类号： B32B9/04

    CPC分类号： C09D183/02 ,  C09D183/04 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

    摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

    摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
    6.
    发明授权
    Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts 失效
    用于形成二氧化硅基涂膜的组合物，二氧化硅基涂膜及其制备方法和电子部件

    公开(公告)号：US07358300B2

    公开(公告)日：2008-04-15

    申请号：US10926321

    申请日：2004-08-26

    申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

    IPC分类号： C08K5/17

    CPC分类号： H01L23/5329 ,  C09D183/02 ,  C09D183/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

    摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

    摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

    Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film
    7.
    发明申请
    Composition, methods for forming low-permittivity film using the composition, low-permittivity film, and electronic part having the low-permittivity film 审中-公开
    组合物，使用该组合物形成低电容率膜的方法，低介电常数薄膜和具有低介电常数膜的电子部件

    公开(公告)号：US20060199021A1

    公开(公告)日：2006-09-07

    申请号：US11430865

    申请日：2006-05-10

    申请人： Takenori Narita ,  Hiroyuki Morisima ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Haruaki Sakurai ,  Nobuko Terada

    发明人： Takenori Narita ,  Hiroyuki Morisima ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Haruaki Sakurai ,  Nobuko Terada

    IPC分类号： B32B27/00 ,  H01L21/00 ,  C08L83/00 ,  C08G77/00

    CPC分类号： C08L83/04 ,  C08G77/045 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/31695 ,  H01L23/5222 ,  H01L2924/0002 ,  H05K1/024 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2203/083 ,  H05K2203/1105 ,  Y10T428/31663 ,  C08L2666/04 ,  H01L2924/00

    摘要： The present invention provides a composition comprising (a) a thermally decomposable polymer and (b) a siloxane oligomer evenly dissolved in (c) an organic solvent; a composition comprising (a) a thermally decomposable polymer, (b) a siloxane oligomer, and (c) an organic solvent in which both of the ingredients (a) and (b) are soluble; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith and then heating the resulting film to condense the siloxane oligomer and remove the thermally decomposable polymer; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith, subsequently conducting a first heating step in which the siloxane oligomer is crosslinked while keeping the thermally decomposable polymer remaining in the film, and then conducting a second heating step in which the thermally decomposable polymer is removed; a low-permittivity film formed by either of the methods for low-permittivity film formation; and an electronic part having the low-permittivity film.

    摘要翻译： 本发明提供一种组合物，其包含（a）可热分解的聚合物和（b）均匀溶解于（c）有机溶剂中的硅氧烷低聚物; （a）可热分解的聚合物，（b）硅氧烷低聚物和（c）成分（a）和（b）都可溶的有机溶剂的组合物; 一种形成低介电常数薄膜的方法，其特征在于将组合物施加到基底上以形成包含可热分解聚合物和与其均匀相容的硅氧烷低聚物的复合膜，然后加热所得膜以冷凝硅氧烷低聚物并除去热分解 聚合物; 一种形成低介电常数薄膜的方法，其特征在于将组合物涂布在基材上以形成包含可热分解聚合物和与其均匀相容的硅氧烷低聚物的复合膜，随后进行第一加热步骤，其中硅氧烷低聚物交联同时保持 残留在该膜中的可热分解聚合物，然后进行除去热分解聚合物的第二加热步骤; 通过低介电常数薄膜形成方法之一形成的低介电常数膜; 以及具有低介电常数膜的电子部件。