公开(公告)号：US07687590B2

公开(公告)日：2010-03-30

申请号：US11207199

申请日：2005-08-19

申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

IPC分类号： C08G77/06

CPC分类号： H01L23/5329 ,  C09D183/02 ,  C09D183/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

公开(公告)号：US20060052566A1

公开(公告)日：2006-03-09

申请号：US11207199

申请日：2005-08-19

申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

IPC分类号： C08L83/04 ,  B32B9/04

CPC分类号： H01L23/5329 ,  C09D183/02 ,  C09D183/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

公开(公告)号：US20050255326A1

公开(公告)日：2005-11-17

申请号：US11040119

申请日：2005-01-24

申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

IPC分类号： B05D3/02 ,  B32B9/04 ,  C08G77/08 ,  C08K3/34 ,  C09D183/02 ,  C09D183/04 ,  H01L23/532

CPC分类号： C09D183/02 ,  C09D183/04 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

公开(公告)号：US20050119394A1

公开(公告)日：2005-06-02

申请号：US10926321

申请日：2004-08-26

申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

IPC分类号： B05D3/02 ,  B32B9/04 ,  C08G77/08 ,  C08K3/34 ,  C09D5/25 ,  C09D183/02 ,  C09D183/04 ,  H01L23/532

CPC分类号： H01L23/5329 ,  C09D183/02 ,  C09D183/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

公开(公告)号：US07682701B2

公开(公告)日：2010-03-23

申请号：US11040119

申请日：2005-01-24

申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

IPC分类号： B32B9/04

CPC分类号： C09D183/02 ,  C09D183/04 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

公开(公告)号：US07358300B2

公开(公告)日：2008-04-15

申请号：US10926321

申请日：2004-08-26

申请人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

发明人： Haruaki Sakurai ,  Koichi Abe ,  Kazuhiro Enomoto ,  Shigeru Nobe

IPC分类号： C08K5/17

CPC分类号： H01L23/5329 ,  C09D183/02 ,  C09D183/04 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31663 ,  H01L2924/00

摘要： The composition for forming silica based coating of the invention comprises siloxane resin such as an alkoxysilane as component (a), a solvent such as an alcohol capable of dissolving the siloxane resin as component (b), an ammonium salt, etc. as component (c) and a thermal decomposing/volatile compound as component (d), wherein the stress of the coating obtained by heat treatment at 150° C./3 min is 10 MPa and the specific permittivity of the silica based coating obtained by final curing is less than 3.0. The composition for forming silica based coating according to the invention can form a silica based coating having low permittivity, excellent adhesion and sufficient mechanical strength.

摘要翻译： 用于形成本发明的二氧化硅基涂层的组合物包含作为组分（a）的烷氧基​​硅烷等硅氧烷树脂，作为组分（b）的硅氧烷树脂溶解性醇的溶剂，铵盐等作为组分（ c）和作为组分（d）的热分解/挥发性化合物，其中通过在150℃/分钟热处理获得的涂层的应力为10MPa，并且通过最终固化获得的二氧化硅基涂层的比介电常数为 小于3.0。 根据本发明的用于形成二氧化硅基涂层的组合物可以形成具有低介电常数，优异的粘附性和足够的机械强度的二氧化硅基涂层。

公开(公告)号：US20060199021A1

公开(公告)日：2006-09-07

申请号：US11430865

申请日：2006-05-10

申请人： Takenori Narita ,  Hiroyuki Morisima ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Haruaki Sakurai ,  Nobuko Terada

发明人： Takenori Narita ,  Hiroyuki Morisima ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Haruaki Sakurai ,  Nobuko Terada

IPC分类号： B32B27/00 ,  H01L21/00 ,  C08L83/00 ,  C08G77/00

CPC分类号： C08L83/04 ,  C08G77/045 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/31695 ,  H01L23/5222 ,  H01L2924/0002 ,  H05K1/024 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2203/083 ,  H05K2203/1105 ,  Y10T428/31663 ,  C08L2666/04 ,  H01L2924/00

摘要： The present invention provides a composition comprising (a) a thermally decomposable polymer and (b) a siloxane oligomer evenly dissolved in (c) an organic solvent; a composition comprising (a) a thermally decomposable polymer, (b) a siloxane oligomer, and (c) an organic solvent in which both of the ingredients (a) and (b) are soluble; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith and then heating the resulting film to condense the siloxane oligomer and remove the thermally decomposable polymer; a method for forming a low-permittivity film characterized by applying the composition to a substrate to form a composite film comprising the thermally decomposable polymer and the siloxane oligomer evenly compatibilized therewith, subsequently conducting a first heating step in which the siloxane oligomer is crosslinked while keeping the thermally decomposable polymer remaining in the film, and then conducting a second heating step in which the thermally decomposable polymer is removed; a low-permittivity film formed by either of the methods for low-permittivity film formation; and an electronic part having the low-permittivity film.

摘要翻译： 本发明提供一种组合物，其包含（a）可热分解的聚合物和（b）均匀溶解于（c）有机溶剂中的硅氧烷低聚物; （a）可热分解的聚合物，（b）硅氧烷低聚物和（c）成分（a）和（b）都可溶的有机溶剂的组合物; 一种形成低介电常数薄膜的方法，其特征在于将组合物施加到基底上以形成包含可热分解聚合物和与其均匀相容的硅氧烷低聚物的复合膜，然后加热所得膜以冷凝硅氧烷低聚物并除去热分解 聚合物; 一种形成低介电常数薄膜的方法，其特征在于将组合物涂布在基材上以形成包含可热分解聚合物和与其均匀相容的硅氧烷低聚物的复合膜，随后进行第一加热步骤，其中硅氧烷低聚物交联同时保持 残留在该膜中的可热分解聚合物，然后进行除去热分解聚合物的第二加热步骤; 通过低介电常数薄膜形成方法之一形成的低介电常数膜; 以及具有低介电常数膜的电子部件。

公开(公告)号：US09022834B2

公开(公告)日：2015-05-05

申请号：US13139117

申请日：2011-06-10

申请人： Eiichi Satou ,  Munehiro Oota ,  Kanshi Chinone ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Tadahiro Kimura ,  Masato Fukasawa ,  Masanobu Habiro ,  Yousuke Hoshi

发明人： Eiichi Satou ,  Munehiro Oota ,  Kanshi Chinone ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Tadahiro Kimura ,  Masato Fukasawa ,  Masanobu Habiro ,  Yousuke Hoshi

IPC分类号： B24B1/00 ,  C09G1/02 ,  H01L21/3105 ,  C09K3/14

CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463

摘要： The polishing solution for CMP according to the invention comprises abrasive grains, an additive and water, and the polishing solution comprises an organic compound satisfying specified conditions as the additive. The polishing method of the invention is for polishing of a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad.

摘要翻译： 根据本发明的用于CMP的抛光溶液包括磨粒，添加剂和水，并且抛光溶液包含满足特定条件的添加剂的有机化合物。 本发明的抛光方法是用于在表面上抛光具有氧化硅膜的基板，并且抛光方法包括用抛光垫抛光氧化硅膜的步骤，同时在氧化硅膜之间提供用于CMP的抛光溶液 和抛光垫。

公开(公告)号：US20110275285A1

公开(公告)日：2011-11-10

申请号：US13139117

申请日：2011-06-10

申请人： Eiichi Satou ,  Munehiro Oota ,  Kanshi Chinone ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Tadahiro Kimura ,  Masato Fukasawa ,  Masanobu Habiro ,  Yousuke Hoshi

发明人： Eiichi Satou ,  Munehiro Oota ,  Kanshi Chinone ,  Shigeru Nobe ,  Kazuhiro Enomoto ,  Tadahiro Kimura ,  Masato Fukasawa ,  Masanobu Habiro ,  Yousuke Hoshi

IPC分类号： B24B1/00 ,  C09G1/02

CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463

摘要： The polishing solution for CMP according to the invention comprises abrasive grains, an additive and water, and the polishing solution comprises an organic compound satisfying specified conditions as the additive. The polishing method of the invention is for polishing of a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad.

摘要翻译： 根据本发明的用于CMP的抛光溶液包括磨粒，添加剂和水，并且抛光溶液包含满足特定条件的添加剂的有机化合物。 本发明的抛光方法是用于在表面上抛光具有氧化硅膜的基板，并且抛光方法包括用抛光垫抛光氧化硅膜的步骤，同时在氧化硅膜之间提供用于CMP的抛光溶液 和抛光垫。

公开(公告)号：US08836089B2

公开(公告)日：2014-09-16

申请号：US13823260

申请日：2011-09-02

申请人： Akitoshi Tanimoto ,  Shigeru Nobe ,  Kei Kasuya ,  Hiroshi Matsutani ,  Takumi Ueno ,  Yu Aoki ,  Shingo Tahara

发明人： Akitoshi Tanimoto ,  Shigeru Nobe ,  Kei Kasuya ,  Hiroshi Matsutani ,  Takumi Ueno ,  Yu Aoki ,  Shingo Tahara

IPC分类号： H01L23/29 ,  H01L21/47 ,  G03F7/075 ,  G03F7/039 ,  G03F7/40 ,  G03F7/022

CPC分类号： G03F7/039 ,  G03F7/0226 ,  G03F7/0751 ,  G03F7/40 ,  H01L2224/11

摘要： The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

摘要翻译： 根据本发明的正型感光性树脂组合物包含具有酚羟基的碱溶性树脂，通过光产生酸的化合物，热交联剂和具有至少一个选自以下的官能团的硅烷化合物： 环氧基和硫醚基。