发明申请
- 专利标题： Electronic parts and method of manufacturing electronic parts packaging structure
- 专利标题（中）： 电子零件和电子零件包装结构制造方法
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申请号： US11122098申请日： 2005-05-05
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公开(公告)号： US20050258447A1公开(公告)日： 2005-11-24
- 发明人: Kiyoshi Oi , Noriyoshi Shimizu , Yasuyoshi Horikawa
- 申请人： Kiyoshi Oi , Noriyoshi Shimizu , Yasuyoshi Horikawa
- 申请人地址： JP Nagano-shi
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址： JP Nagano-shi
- 优先权： JP2004-146406 20040517
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60 ; H01L23/538 ; H01L29/24
摘要：
A method of manufacturing an electronic parts packaging structure of the present invention, includes a step of mounting an electronic parts, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a step of forming an insulating layer to cover the electronic parts, a step of forming a via hole in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal, and a step of forming a wiring pattern, which is connected electrically to the connection terminal via the via hole, on the insulating layer.
公开/授权文献
- US07229856B2 Method of manufacturing electronic part packaging structure 公开/授权日：2007-06-12