摘要:
A method of manufacturing an electronic parts packaging structure of the present invention, includes a step of mounting an electronic parts, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a step of forming an insulating layer to cover the electronic parts, a step of forming a via hole in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal, and a step of forming a wiring pattern, which is connected electrically to the connection terminal via the via hole, on the insulating layer.
摘要:
A method of manufacturing an electronic part packaging structure including a step of mounting an electronic part, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a step of forming an insulating layer to cover the electronic part, a step of forming a via hole in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal, and a step of forming a wiring pattern, which is connected electrically to the connection terminal via the via hole, on the insulating layer.
摘要:
An encapsulated electronic part packaging structure includes a step of mounting an electronic part having a connection terminal and a passivating film to cover the connection terminal, mounted on a body to direct the connection terminal upward. An insulating layer is formed to cover the electronic part, and a via hole is formed in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal. A wiring pattern, which is connected electrically to the connection terminal via the via hole, is formed on the insulating layer.
摘要:
A method of manufacturing an electronic parts packaging structure of the present invention, includes a step of mounting an electronic parts, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a step of forming an insulating layer to cover the electronic parts, a step of forming a via hole in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal, and a step of forming a wiring pattern, which is connected electrically to the connection terminal via the via hole, on the insulating layer.
摘要:
An electronic part-containing element used by being incorporated in an electronic device, in which the electronic part-containing element comprises an insulating support member which does not take part in the constitution of the electronic device but is removed in the process of producing the electronic device, and a circuit module supported by the support member, and the circuit module contains one or more electronic parts, each in the form of a thin film, therein and has connection terminals for the electronic part at least on the surface thereof that comes into contact with the support member.
摘要:
In a capacitor device of the present invention, a capacitor parts that has a pair of terminals on both end sides respectively is embedded in an insulating film in a state that a lower surface of the capacitor parts is not covered with the insulating film, then upper wiring patterns that are connected to upper surfaces of a pair of terminals via holes formed in the insulating film on a pair of terminals are formed on an upper surface side of the insulating film respectively, and then lower wiring patterns that are connected to lower surfaces of a pair of terminals are formed on a lower surface side of the insulating film respectively.
摘要:
A method of manufacturing an electronic parts packaging structure of the present invention, includes the steps of forming a first uncured resin layer on a substrate, arranging an electronic parts on the first uncured resin layer, forming a second uncured resin layer that covers the electronic parts, and obtaining an insulating layer, in which the electronic parts is embedded, by curing the first uncured resin layer and the second uncured resin layer by annealing.
摘要:
A method of manufacturing an electronic parts packaging structure of the present invention, includes the steps of forming a first uncured resin layer on a substrate, arranging an electronic parts on the first uncured resin layer, forming a second uncured resin layer that covers the electronic parts, and obtaining an insulating layer, in which the electronic parts is embedded, by curing the first uncured resin layer and the second uncured resin layer by annealing.
摘要:
In a capacitor device of the present invention, a capacitor parts that has a pair of terminals on both end sides respectively is embedded in an insulating film in a state that a lower surface of the capacitor parts is not covered with the insulating film, then upper wiring patterns that are connected to upper surfaces of a pair of terminals via holes formed in the insulating film on a pair of terminals are formed on an upper surface side of the insulating film respectively, and then lower wiring patterns that are connected to lower surfaces of a pair of terminals are formed on a lower surface side of the insulating film respectively.
摘要:
A substrate is disclosed that includes an inductor that is realized by first wiring, and resin including high magnetic permeability filler material that covers the first wiring.