发明申请
- 专利标题： Semi-conductor component with condensators buried in the substrate and insulated component layer thereof
- 专利标题（中）： 半导体部件与冷凝器埋在基板和绝缘部件层中
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申请号： US10523944申请日： 2003-09-13
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公开(公告)号： US20050269617A1公开(公告)日： 2005-12-08
- 发明人: Franz Hofmann , Volker Lehmann , Lothar Risoh , Wolfgang Rosner , Michael Specht
- 申请人： Franz Hofmann , Volker Lehmann , Lothar Risoh , Wolfgang Rosner , Michael Specht
- 优先权： DE10242877.8 20020916
- 国际申请： PCT/DE03/03044 WO 20030913
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/334 ; H01L21/8242 ; H01L21/84 ; H01L27/108 ; H01L27/12 ; H01L29/94 ; H01L29/76
摘要：
A semiconductor substrate and a semiconductor circuit formed therein and associated fabrication methods are provided. A multiplicity of depressions with a respective dielectric layer and a capacitor electrode are formed for realizing buried capacitors in a carrier substrate and an actual semiconductor component layer being insulated from the carrier substrate by an insulation layer.
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