发明申请
- 专利标题: Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
- 专利标题(中): 估算抛光轮廓或抛光量的方法,抛光方法和抛光装置
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申请号: US11176184申请日: 2005-07-08
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公开(公告)号: US20060009127A1公开(公告)日: 2006-01-12
- 发明人: Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
- 申请人: Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
- 优先权: JP2004-202970 20040709
- 主分类号: B24B49/00
- IPC分类号: B24B49/00
摘要:
A polishing method can automatically reset the polishing conditions according to the state of a polishing member based on data on the polishing profile changing with time, thereby extending the life of the polishing member and obtaining flatness of the polished surface with higher accuracy. The polishing method, including the steps of: independently applying a desired pressure by each of the pressing portions of the top ring on the polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that the difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
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