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公开(公告)号：US20070224916A1
公开(公告)日：2007-09-27
申请号：US11802353
申请日：2007-05-22
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
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公开(公告)号：US07234999B2
公开(公告)日：2007-06-26
申请号：US11599351
申请日：2006-11-15
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
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3.发明申请Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US20070061036A1
公开(公告)日：2007-03-15
申请号：US11599351
申请日：2006-11-15
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
IPC分类号： G06F19/00
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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4.发明授权Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US07361076B2
公开(公告)日：2008-04-22
申请号：US11802353
申请日：2007-05-22
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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5.发明授权Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US07150673B2
公开(公告)日：2006-12-19
申请号：US11176184
申请日：2005-07-08
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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6.发明申请Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus 有权估算抛光轮廓或抛光量的方法，抛光方法和抛光装置公开(公告)号：US20060009127A1
公开(公告)日：2006-01-12
申请号：US11176184
申请日：2005-07-08
申请人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
发明人： Kunihiko Sakurai , Tetsuji Togawa , Yoshihiro Mochizuki , Akira Fukuda , Hirokuni Hiyama , Kazuto Hirokawa , Manabu Tsujimura
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/005 , B24B37/042 , B24B49/00
摘要： A polishing method can automatically reset the polishing conditions according to the state of a polishing member based on data on the polishing profile changing with time, thereby extending the life of the polishing member and obtaining flatness of the polished surface with higher accuracy. The polishing method, including the steps of: independently applying a desired pressure by each of the pressing portions of the top ring on the polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that the difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位研磨条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法，包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定的压力值估计抛光对象的抛光轮廓，并计算推荐的抛光压力值，使得抛光对象在一定的抛光条件下抛光的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。
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公开(公告)号：US06390901B1
公开(公告)日：2002-05-21
申请号：US09397916
申请日：1999-09-17
申请人： Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa , Hisanori Matsuo , Tetsuji Togawa , Satoshi Wakabayashi
发明人： Hirokuni Hiyama , Yutaka Wada , Kazuto Hirokawa , Hisanori Matsuo , Tetsuji Togawa , Satoshi Wakabayashi
IPC分类号： B24B2900
摘要： An object of the present invention is to provide a polishing apparatus with a grinding plate that can easily and reliably be installed on and detached from a turntable. The polishing apparatus has a grinding plate tool, fixedly mounted on the turntable, which includes the grinding plate, and a top ring for holding a workpiece to be polished and pressing the workpiece against the grinding plate in sliding contact therewith for polishing a surface of the workpiece to a flat, mirror finish. A clamping mechanism is mounted in the turntable for fixing an outer circumferential flange of the grinding plate tool to the turntable.
摘要翻译： 本发明的目的是提供一种具有研磨板的抛光装置，其可以容易且可靠地安装在转台上和从转盘上拆下。 抛光装置具有固定安装在转盘上的研磨板工具，其包括研磨板，以及用于保持要抛光的工件的顶环，并将工件抵靠研磨板与其滑动接触，以抛光其中的表面 工件平整，镜面光洁。 夹持机构安装在转盘中，用于将研磨板工具的外周凸缘固定到转台上。
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公开(公告)号：US06579148B2
公开(公告)日：2003-06-17
申请号：US10166093
申请日：2002-06-11
IPC分类号： B24B4900
CPC分类号： B24B37/16 , B24B37/013 , B24B49/14 , B24B49/16 , B24B57/02
摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.
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公开(公告)号：US06458012B1
公开(公告)日：2002-10-01
申请号：US09612215
申请日：2000-07-07
IPC分类号： B24B4900
CPC分类号： B24B37/16 , B24B37/013 , B24B49/14 , B24B49/16 , B24B57/02
摘要： A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.
摘要翻译： 抛光装置用于抛光诸如半导体晶片或玻璃基板的工件的表面。 抛光装置包括：抛光台，其上具有研磨面，多个工件保持件，每个工件保持件用于保持工件并将工件压靠在抛光表面上;以及控制器，其分别控制工件保持器，使得工件保持器的抛光操作 相互独立地控制。
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公开(公告)号：US06398626B1
公开(公告)日：2002-06-04
申请号：US09612216
申请日：2000-07-07
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B53/017 , B24D7/14 , B24D13/147
摘要： A polishing apparatus is used for polishing a plate-like workpiece, such as a semiconductor wafer or a glass substrate. The polishing apparatus has a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a dresser for dressing the polishing surface by pressing a desired position of the polishing surface.
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