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89 条记录 (耗时 0.025 秒)

    Fuel injection system with injection characteristic learning function
    1.
    发明授权
    Fuel injection system with injection characteristic learning function 有权
    具有注射特性学习功能的燃油喷射系统

    公开(公告)号：US07895990B2

    公开(公告)日：2011-03-01

    申请号：US12230454

    申请日：2008-08-28

    申请人： Kouji Ishizuka ,  Kouichi Sugiyama ,  Manabu Tsujimura ,  Tetsuya Ohno

    发明人： Kouji Ishizuka ,  Kouichi Sugiyama ,  Manabu Tsujimura ,  Tetsuya Ohno

    IPC分类号： F02M51/00 ,  B60T7/12

    CPC分类号： F02D41/2438 ,  F02D41/2467 ,  F02D41/40 ,  F02D41/402 ,  Y02T10/44

    摘要： A fuel injection system designed to determine a correction value for correcting the quantity of fuel sprayed from a fuel injector into an internal combustion engine. The fuel injection system instructs the fuel injector to inject the fuel into the engine a plurality of times cyclically to learn an injection characteristic unique to the fuel injector and changes an injection duration for which the fuel is to be sprayed in each of injection events to disperse the injection durations evenly around a target injection quantity, thereby enabling the correction value to be determined in a decreased number of injections of fuel for a decreased amount of time.

    摘要翻译： 一种燃料喷射系统，其被设计成确定用于校正从燃料喷射器喷射到内燃机中的燃料量的校正值。 燃料喷射系统指示燃料喷射器循环地将燃料喷射到发动机中多次，以了解燃料喷射器独有的喷射特性，并且在每个喷射事件中改变喷射燃料的喷射持续时间以分散 喷射持续时间均匀地围绕目标喷射量，从而能够以减少的时间量在减少的燃料喷射量中确定校正值。

    Interconnects forming method and interconnects forming apparatus
    7.
    发明申请
    Interconnects forming method and interconnects forming apparatus 审中-公开
    互连形成方法和互连形成装置

    公开(公告)号：US20050282378A1

    公开(公告)日：2005-12-22

    申请号：US10941882

    申请日：2004-09-16

    申请人： Akira Fukunaga ,  Manabu Tsujimura ,  Hiroaki Inoue

    发明人： Akira Fukunaga ,  Manabu Tsujimura ,  Hiroaki Inoue

    IPC分类号： C23C16/00 ,  C23C16/04 ,  C23C16/06 ,  H01L21/4763 ,  H01L21/768

    CPC分类号： H01L21/76843 ,  C23C16/042 ,  C23C16/045 ,  C23C16/06 ,  H01L21/7684 ,  H01L21/76849

    摘要： An interconnects forming method and an interconnects forming apparatus are useful for embedding a conductive material (interconnect material), such as copper or silver, into interconnect recesses provided in a surface of a substrate, such as a semiconductor wafer, to thereby form embedded interconnects, and selectively covering the surfaces of embedded interconnects with a metal film (protective film) to provide a multi-level structure. The interconnects forming method comprises: providing a substrate which has been prepared by forming a barrier layer over a substrate surface having interconnect recesses formed in an insulating film, and then forming a film of an interconnect material in the interconnect recesses and over the substrate surface; removing extra interconnect material formed over the substrate surface, thereby forming interconnects with the interconnect material embedded in the interconnect recesses and making the barrier layer present in the other portion than the interconnect-formed portion exposed; and forming a metal film selectively on surfaces of interconnects.

    摘要翻译： 互连形成方法和互连形成装置可用于将诸如铜或银的导电材料（互连材料）嵌入设置在诸如半导体晶片的基板的表面中的互连凹槽中，从而形成嵌入式互连， 并且用金属膜（保护膜）选择性地覆盖嵌入式互连件的表面以提供多层结构。 互连形成方法包括：提供通过在绝缘膜上形成具有互连凹槽的衬底表面上形成阻挡层，然后在互连凹槽中并在衬底表面上形成互连材料的膜而制备的衬底; 去除形成在衬底表面上的额外的互连材料，从而与嵌入在互连凹槽中的互连材料形成互连，并使阻挡层存在于暴露的互连形成部分的另一部分中; 并在互连表面上选择性地形成金属膜。

    Polishing apparatus
    8.
    再颁专利
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：USRE38878E1

    公开(公告)日：2005-11-15

    申请号：US08993893

    申请日：1997-12-18

    申请人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

    发明人： Masayoshi Hirose ,  Manabu Tsujimura ,  Seiji Ishikawa ,  Norio Kimura ,  You Ishii

    IPC分类号： B24B7/22 ,  B24B37/04

    CPC分类号： B24B37/107 ,  B24B37/30

    摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.

    摘要翻译： 诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。 顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。 在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。 扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

    Substrate plating apparatus
    10.
    发明授权
    Substrate plating apparatus 有权
    基板电镀装置

    公开(公告)号：US06929722B2

    公开(公告)日：2005-08-16

    申请号：US09945711

    申请日：2001-09-05

    申请人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    发明人： Akihisa Hongo ,  Naoaki Ogure ,  Hiroaki Inoue ,  Norio Kimura ,  Fumio Kuriyama ,  Manabu Tsujimura ,  Kenichi Suzuki ,  Atsushi Chono

    IPC分类号： C25D7/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/768 ,  C25D17/00 ,  H01M4/29 ,  C23B3/00

    CPC分类号： H01L21/67167 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/76849 ,  H01L21/76877 ,  Y10S134/902

    摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

    摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。