摘要:
A threaded reinforcing bar coupling structure comprises a pair of reinforcing bars and a tubular coupler connecting the pair of reinforcing bars. Each of the reinforcing bars is a deformed reinforcing bar having spiral node portions on an outer periphery of a reinforcing bar main body having a round shaft shape. A cylindrical portion with node portions removed is formed on an end portion of the reinforcing bar, and a male threaded portion is formed on the cylindrical portion. The male threaded portion has hardness or tensile strength greater than that of a remaining portion of the reinforcing bar. The pair of reinforcing bars is connected by the screw tubular coupler that is screwed onto the male threaded portions.
摘要:
A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and the wafer held by a holding member (top ring) and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.
摘要:
A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer W by applying a pressure between a polishing member (polishing pad) 201 and the wafer W held by a holding member (top ring) 52 and relatively moving the polishing member 201 to the wafer W. The polishing apparatus comprises a top ring 52 for holding the wafer W, a pressure adjusting mechanism 206 for adjusting a supporting pressure with which the wafer W is supported on a supporting surface by a retainer ring 203, and a control unit 208 for controlling the pressure adjusting mechanism 206 to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer W. The top ring 52 comprises an air bag 202 for pressing the wafer W against the polishing pad 201, a retainer ring 203 which surrounds the wafer W, and an air bag 204 for pressing the retainer ring 203.
摘要:
A magnetic film forming apparatus can form a magnetic film, especially a magnetic alloy film, selectively on a metal surface exposed on a surface of a substrate, such as a semiconductor wafer. The magnetic film forming apparatus comprises an electroless plating apparatus having a magnetic field generation apparatus for generating a magnetic field around and parallel to a substrate disposed such that the surface of the substrate is in contact with a plating solution in a plating tank.
摘要:
A polishing method can prevent scratches in a polished surface of a polishing object, caused by foreign matter adhering to a surface of a polishing member, thus preventing the attendant lowering of the yield even when the polishing object is large-sized. The polishing method includes: specifying a foreign matter adhesion position or a foreign matter adhesion area in a surface of the polishing member; and intensively cleaning the foreign matter adhesion position or the foreign matter adhesion area in the surface of the polishing member.
摘要:
A beam source has a plasma generating chamber and a gas inlet port for introducing a gas into the plasma generating chamber. The beam source includes a plasma generator for generating positive-negative ion plasma containing positive ions at a density of at least 1010 ions/cm3 and negative ions from the gas. The beam source also includes a plasma potential adjustment electrode disposed in the plasma generating chamber and a grid electrode having a plurality of beam extraction holes formed therein. The beam extraction holes have a diameter of at least 0.5 mm. The beam source has a first power supply for applying a voltage of at most 500 V between the plasma potential adjustment electrode and the grid electrode.
摘要翻译:光束源具有等离子体产生室和用于将气体引入等离子体产生室的气体入口端口。 光束源包括等离子体发生器,用于产生具有至少10×10 5 / cm 3的密度的正离子和来自气体的负离子。 光束源还包括设置在等离子体发生室中的等离子体电位调节电极和形成有多个光束提取孔的栅格电极。 光束提取孔的直径至少为0.5mm。 光束源具有用于在等离子体电位调节电极和栅电极之间施加至多500V的电压的第一电源。
摘要:
A portable generator includes a metal shroud surrounding at least a crankcase and a cylinder block of an engine. The engine is directly mounted to the shroud. The shroud forms an effective radiating element and gives an additional heat-radiating surface to the engine, thereby increasing the heat radiation capacity of the engine. Heat generated from the engine while running can, therefore, be radiated efficiently. The shroud is mounted within a sound insulating case, so that the portable generator has a double sound-insulating structure. The noise-proofing property of the portable generator is, therefore, very high.
摘要:
In order to accurately conduct a leakage test in a short time, an initial pressure higher than a test pressure is first supplied into a hollow object to be tested. Then, part of the pressure within the object is relieved to decrease the temperature within the object to the ambient temperature so that the pressure within the object can be stabilized at the test pressure. Then, a variation in the pressure within the object is detected to determine whether there is any leakage in the object. In the case where a negative pressure is utilized, an initial pressure lower than the test pressure is first supplied into the object, and then part of the pressure within the object is relieved by introducing the ambient air into the object, to increase the temperature within the object to the ambient temperature so that the pressure within the object can be stabilized at the test pressure. Then, a variation in the pressure within the object is detected to determine whether there is any leakage in the object.
摘要:
A method and apparatus for grouping metal ingots of predetermined shape into ingot groups each consisting of four ingots and stacking these ingot groups in tiers to form a stack. In the method and apparatus, two kinds of ingot groups of different patterns are automatically alternately stacked in tiers utilizing the movement of a conveyor conveying the ingots, so that dangerous relative sliding movement of the ingots in the stack may not occur during transportation.
摘要:
A method of dressing a polishing member with a diamond dresser having diamond particles arranged on a surface thereof is provided. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the dressing conditions determined. The simulation includes calculation of the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.