发明申请
- 专利标题： Methods of processing substrates during semiconductor manufacturing processes
- 专利标题（中）： 在半导体制造工艺中处理衬底的方法
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申请号： US11193088申请日： 2005-07-29
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公开(公告)号： US20060027252A1公开(公告)日： 2006-02-09
- 发明人: Chang-Sup Mun , Chang-Ki Hong , Sang-Jun Choi , Hyung-Ho Ko , Sang-Yong Kim
- 申请人： Chang-Sup Mun , Chang-Ki Hong , Sang-Jun Choi , Hyung-Ho Ko , Sang-Yong Kim
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR10-2004-0061232 20040803
- 主分类号： B08B3/00
- IPC分类号： B08B3/00
摘要：
The present invention provides methods of processing a substrate by contacting the substrate with an inorganic solution including an organic additive, rinsing the substrate with an organic alcohol, and rinsing the substrate with deionized water. Related substrates and devices are also disclosed.
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