发明申请
- 专利标题： Electroless plating apparatus and electroless plating method
- 专利标题（中）： 无电镀设备和化学镀方法
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申请号： US10528117申请日： 2003-05-23
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公开(公告)号： US20060037858A1公开(公告)日： 2006-02-23
- 发明人: Yoshinori Marumo , Miho Jomen , Takayuki Komiya , Hiroshi Sato , Gishi Chung
- 申请人： Yoshinori Marumo , Miho Jomen , Takayuki Komiya , Hiroshi Sato , Gishi Chung
- 申请人地址： JP Tokyo 107-8481
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo 107-8481
- 优先权： JP2002-273668 20020919
- 国际申请： PCT/JP03/06498 WO 20030523
- 主分类号： C25D17/06
- IPC分类号： C25D17/06
摘要：
A plate is placed near a substrate held by a substrate holding section. A treating liquid is ejected from a treating liquid ejecting section, thereby plating the substrate electrolessly. The treating liquid flows through the gap between the substrate and the plate. Therefore a flow of the treating liquid occurs on the substrate. As a result, a fresh treating liquid can be supplied onto the substrate. Thus, a plating film can be formed very uniformly on the substrate even if the amount of treating liquid is small.