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    Electroless plating apparatus and electroless plating method
    1.
    发明申请
    Electroless plating apparatus and electroless plating method 审中-公开
    无电镀设备和化学镀方法

    公开(公告)号：US20060037858A1

    公开(公告)日：2006-02-23

    申请号：US10528117

    申请日：2003-05-23

    申请人： Yoshinori Marumo ,  Miho Jomen ,  Takayuki Komiya ,  Hiroshi Sato ,  Gishi Chung

    发明人： Yoshinori Marumo ,  Miho Jomen ,  Takayuki Komiya ,  Hiroshi Sato ,  Gishi Chung

    IPC分类号： C25D17/06

    CPC分类号： C23C18/1619 ,  C23C18/1669 ,  C23C18/1678

    摘要： A plate is placed near a substrate held by a substrate holding section. A treating liquid is ejected from a treating liquid ejecting section, thereby plating the substrate electrolessly. The treating liquid flows through the gap between the substrate and the plate. Therefore a flow of the treating liquid occurs on the substrate. As a result, a fresh treating liquid can be supplied onto the substrate. Thus, a plating film can be formed very uniformly on the substrate even if the amount of treating liquid is small.

    摘要翻译： 将板放置在由基板保持部保持的基板附近。 处理液从处理液喷射部喷出，由此无电解地镀覆基板。 处理液体流过基板和板之间的间隙。 因此，处理液的流动发生在基板上。 结果，可以将新鲜的处理液体供应到基底上。 因此，即使处理液的量少，也可以在基板上非常均匀地形成镀膜。

    Electroless plating method and apparatus
    2.
    发明申请
    Electroless plating method and apparatus 审中-公开
    化学镀方法及装置

    公开(公告)号：US20050164499A1

    公开(公告)日：2005-07-28

    申请号：US11082807

    申请日：2005-03-18

    申请人： Yoshinori Marumo ,  Hiroshi Sato ,  Miho Jomen

    发明人： Yoshinori Marumo ,  Hiroshi Sato ,  Miho Jomen

    IPC分类号： C23C18/16 ,  C23C18/18 ,  H01L21/00 ,  H01L21/288 ,  H01L21/768 ,  H01L21/44 ,  H01L21/4763

    CPC分类号： H01L21/288 ,  C23C18/165 ,  H01L21/67028 ,  H01L21/67086 ,  H01L21/76877

    摘要： In a method of electroless plating, catalytically active nuclei are formed on a diffusion inhibiting layer (such as a barrier layer), the catalytically active nuclei being catalytically active on a reducing agent contained in an electroless plating solution, and an electroless plating is then carried out by using the electroless plating solution. The method allows the formation of an electrolessly plated coating on a barrier layer through the acceleration of the reaction of a reducing agent contained in an electroless plating solution by catalytically active nucleus.

    摘要翻译： 在化学镀方法中，在扩散抑制层（例如阻挡层）上形成催化活性核，催化活性核在化学镀溶液中包含的还原剂上具有催化活性的核，然后进行化学镀 通过使用化学镀溶液。 该方法允许通过催化活性核加速化学镀溶液中所含的还原剂的反应，在阻挡层上形成无电镀层。

    Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment
    3.
    发明授权
    Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment 失效
    液体处理设备，液体处理方法，半导体器件制造方法和半导体器件制造设备

    公开(公告)号：US06848457B2

    公开(公告)日：2005-02-01

    申请号：US09849347

    申请日：2001-05-07

    申请人： Yoshinori Marumo ,  Yoshinori Kato ,  Hiroshi Sato ,  Kyungho Park

    发明人： Yoshinori Marumo ,  Yoshinori Kato ,  Hiroshi Sato ,  Kyungho Park

    IPC分类号： C25D21/18 ,  H01L21/00 ,  H01L21/288 ,  B08B3/04

    CPC分类号： H01L21/67167 ,  C25D21/18 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/6723 ,  Y10S134/902

    摘要： Providing liquid treatment equipment capable of largely reducing a frequency of discarding a treatment solution as a whole and capable of implementing smooth and high quality liquid treatment with less manufacturing burden. Equipment comprises a treatment solution bath capable of accommodating a treatment solution for implementing liquid treatment to a substrate to treat, a treatment solution circulating system circulating the accommodated treatment solution between the outside of the treatment solution bath, and a product removal unit removing a reaction product due to the liquid treatment contained in the circulated treatment solution. By circulating the accommodated treatment solution between the outside of the treatment solution bath, reaction products contained in the circulated treatment solution are removed by means of the product removal unit. Thereby, a chemical change substance and a decomposition product remaining in a treatment solution can be removed, resulting in preventing a treatment solution from deteriorating.

    摘要翻译： 提供液体处理设备能够大大降低整体处理溶液的排放频率，能够以较少的制造负担实现平稳高质量的液体处理。 设备包括能够容纳用于对基板进行液体处理的处理溶液的处理溶液浴，以处理在处理溶液浴的外部之间循环所容纳的处理溶液的处理溶液循环系统和去除反应产物的产物去除单元 由于循环处理溶液中所含的液体处理。 通过将处理溶液的外部循环容纳的处理液，通过产品除去单元除去循环处理液中所含的反应产物。 因此，可以除去残留在处理溶液中的化学变化物质和分解产物，从而防止处理溶液劣化。

    Thickness measuring apparatus, substrate processing method, and substrate processing apparatus
    8.
    发明授权
    Thickness measuring apparatus, substrate processing method, and substrate processing apparatus 失效
    厚度测量装置，基板处理方法和基板处理装置

    公开(公告)号：US06331890B1

    公开(公告)日：2001-12-18

    申请号：US09474126

    申请日：1999-12-29

    申请人： Yoshinori Marumo ,  Teruyuki Hayashi

    发明人： Yoshinori Marumo ,  Teruyuki Hayashi

    IPC分类号： G01J400

    CPC分类号： G01B11/0683

    摘要： A film thickness measuring apparatus is provided with a housing which is made up of a base plate and outer cases, and which substantially shuts off the internal region thereof from the outside air, an introduction stage on which a cassette C is mounted, the cassette containing a plurality of substrates which have thin films formed thereon, a measurement stage which is arranged inside the housing and on which the substrate is placed for measuring the film thickness of the thin film, and a conveyance mechanism, arranged inside the housing, for moving the substrates between the inside of the cassette and the measurement stage. A film thickness measuring mechanism is arranged inside the housing. The film thickness measuring mechanism comprises a light emitting mechanism and a detector. The light emitting mechanism includes a laser light source for emitting a laser beam to the thin film on a wafer placed on the measurement stage. The detector detects light reflected from the thin film. On the basis of the information detected by the detector, the film thickness measuring mechanism measures the thickness of the thin film in a non-contact manner. A filter unit is arranged in the housing and located above the measurement stage. Through this filter unit, pure air free of gaseous organic matter is supplied and guided to the region above the measurement stage.

    摘要翻译： 薄膜厚度测量装置设置有由基板和外壳组成的壳体，其基本上从外部空气中切断其内部区域，安装盒C的导入台，所述盒体包含 在其上形成有薄膜的多个基板，布置在壳体内部并且放置基板以测量薄膜的膜厚度的测量台，以及布置在壳体内部的用于移动 盒子内部和测量台之间的衬底。 膜厚测量机构设置在壳体内。 膜厚测量机构包括发光机构和检测器。 发光机构包括用于在放置在测量台上的晶片上向激光束发射激光的激光光源。 检测器检测从薄膜反射的光。 基于由检测器检测到的信息，膜厚测量机构以非接触的方式测量薄膜的厚度。 过滤器单元布置在壳体中并位于测量台的上方。 通过该过滤器单元，将不含气态有机物的纯空气供给并引导到测量台上方的区域。

    Manufacturing method of glass substrate for magnetic disk, and manufacturing method of magnetic disk
    9.
    发明申请
    Manufacturing method of glass substrate for magnetic disk, and manufacturing method of magnetic disk 有权
    磁盘用玻璃基板的制造方法以及磁盘的制造方法

    公开(公告)号：US20060070980A1

    公开(公告)日：2006-04-06

    申请号：US11237868

    申请日：2005-09-29

    申请人： Yoshinori Marumo ,  Intanon Sitalaphruek

    发明人： Yoshinori Marumo ,  Intanon Sitalaphruek

    IPC分类号： C03C15/00

    CPC分类号： C03C23/0075 ,  C03C15/00 ,  C03C15/02 ,  C03C19/00 ,  G11B5/7315 ,  G11B5/8404

    摘要： A method for manufacturing a glass substrate for a magnetic disk comprises mirror surface polishing and cleaning of a glass substrate, wherein polishing agent of which the principal component is rare-earth oxide with content of fluorine 5% by weight or less, is supplied to the glass substrate, the surface of the glass substrate is subjected to mirror surface polishing by relatively moving the polishing cloth and the glass substrate, then this glass substrate is brought into contact with a cleaning solution including ascorbic acid, fluorine ion, and sulfuric acid of 3% by weight or more, and the polishing agent is dissolved and removed. The concentration of the ascorbic acid included in the cleaning solution is 0.1% by weight or more, and the content of the fluorine ion is 1 ppm to 40 ppm. At least a magnetic layer is formed on the obtained glass substrate to manufacture a magnetic disk.

    摘要翻译： 一种用于制造磁盘用玻璃基板的方法，其特征在于，对所述玻璃基板进行镜面研磨和清洗，将主成分为含氟量为5重量％以下的稀土类氧化物的研磨剂供给到 玻璃基板，通过相对移动抛光布和玻璃基板对玻璃基板的表面进行镜面抛光，然后使该玻璃基板与包含抗坏血酸，氟离子和硫酸的清洗溶液接触3 重量％以上，并且研磨剂溶解并除去。 清洗液中含有的抗坏血酸的浓度为0.1重量％以上，氟离子的含量为1〜40ppm。 在获得的玻璃基板上形成至少一层磁性层以制造磁盘。

    Solution treatment system and solution treatment method
    10.
    发明授权
    Solution treatment system and solution treatment method 失效
    固溶处理系统和固溶处理方法

    公开(公告)号：US06752855B2

    公开(公告)日：2004-06-22

    申请号：US10158217

    申请日：2002-05-31

    申请人： Yoshinori Marumo

    发明人： Yoshinori Marumo

    IPC分类号： B01D1900

    CPC分类号： B01D19/0052

    摘要： A plating system comprises: a plating unit which plates a water; a plating solution storage tank which stores a plating solution; and a plating solution supply system which supplies the plating solution in the plating solution storage tank to the plating unit. A dissolved oxygen removing unit which removes dissolved oxygen from the plating solution flowing in the plating solution supply system is provided in the middle of the plating solution supply system.

    摘要翻译： 电镀系统包括：电镀单元，其对水进行平板化; 存储电镀液的电镀液储存槽; 以及电镀液供给系统，其将电镀液储存槽内的电镀液供给到电镀单元。 在电镀液供给系统的中间设置有从电镀液供给系统流动的电镀液中除去溶解氧的溶解氧除去单元。