发明申请
US20060061969A1 Circuit arrangement for cooling of surface mounted semi-conductors
审中-公开
用于冷却表面安装半导体的电路布置
- 专利标题： Circuit arrangement for cooling of surface mounted semi-conductors
- 专利标题（中）： 用于冷却表面安装半导体的电路布置
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申请号： US11228886申请日： 2005-09-16
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公开(公告)号： US20060061969A1公开(公告)日： 2006-03-23
- 发明人: Thord Nilson , Ulf Karlsson , Jan Berglund , Ola Ro , Carl Forborgen , Erik Rocklinger
- 申请人： Thord Nilson , Ulf Karlsson , Jan Berglund , Ola Ro , Carl Forborgen , Erik Rocklinger
- 申请人地址： SE Stockholm
- 专利权人： Danaher Motion Stockholm AB
- 当前专利权人： Danaher Motion Stockholm AB
- 当前专利权人地址： SE Stockholm
- 优先权： SE0402262-0 20040920
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.
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