公开(公告)号：US20060061969A1

公开(公告)日：2006-03-23

申请号：US11228886

申请日：2005-09-16

申请人： Thord Nilson ,  Ulf Karlsson ,  Jan Berglund ,  Ola Ro ,  Carl Forborgen ,  Erik Rocklinger

发明人： Thord Nilson ,  Ulf Karlsson ,  Jan Berglund ,  Ola Ro ,  Carl Forborgen ,  Erik Rocklinger

IPC分类号： H05K7/20

CPC分类号： H05K1/0204 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/10166 ,  H05K2201/10416

摘要： A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.

摘要翻译： 电路装置包括电路板（10），设置在电路板的第一侧上的半导体（12）和设置在电路板的与第一侧相对的第二侧的散热片（15），以及 与电力半导体传热接触。 导电元件（13）设置在电路板的孔（10a）中，其中导热元件位于与半导体和散热片两者的传热接触中，用于传递由半导体 导体到散热片。 提供了一种电路装置，其中通过导热元件提供通过电路板的低热阻路径提供了非常适合于通过自动表面安装工艺组装的紧凑的电路布置。