摘要:
The present invention relates to an electrical drive unit comprising a circuit board, a plurality of components, attached to a first side of the circuit board, a heat sink, arranged on the first side of the circuit board, a positioning assembly, arranged on a second side of the circuit board opposite the first side of the circuit board. The circuit board comprises a plurality of holes between the first and second sides, where through the positioning assembly has a plurality of protrusions arranged against the plurality of components, such that each component of the plurality of components individually is pressed against the heat sink by the positioning assembly.
摘要:
An inverter type drive unit for feeding AC electric power of variable parameters to an electric motor comprises an electronic control section (40), a power converting and an output section comprising one or more identical power modules (11a-c), each forming a complete 3-phase output stage and arranged in a side-by-side disposition in a multiplying direction (A) and clamped by means of retaining devices (14a-c) to a cooling structure (10), wherein the power modules (11a-c) are connected in parallel to DC input terminals (25, 26) and to AC output terminals (32, 33, 34) via conductive sheets (20, 21, 27a-c), whereof the DC connected sheets (20, 21) cover substantially the entire physical surface area covered by the power modules (11a-c) so as to accomplish an even, simultaneous and low impedance DC current supply to all power modules (11a-c).
摘要:
A power terminal for electrical connection of an electric cable to a circuit board comprises a main body (8a) having a central longitudinal axis and means (12, 12a) for attaching a cable to the main body. An eccentric body (8b) integral with the main body (8a) and having a through hole (13) is arranged to receive a screw. A space (20) is provided at the bottom of the power terminal adjacent to the eccentric body. This configuration provides a means for securing the terminal in an easy and efficient way while also providing for mounting of a current measuring device, for example.
摘要:
Processes are disclosed for processing low consistency newsprint pulp including refining the pulp in a first refiner to a consistency of greater than 2%, screening the processed pulp with a slotted screen basket with a slot width of from 0.05 to 0.15 mm, with the withdrawal of the primary reject portion being greater than 50%, withdrawing the accept portion for further processing, dewatering the reject portion to provide a high consistency pulp, refining the high consistency pulp in a second refiner, screening the processed high width consistency pulp with a slotted screen basket having a slot of less than 0.15 mm, and combining the two accept portions for the further processing steps.
摘要:
The present invention relates to a method and device for manufacturing coated sleeves, whereby the sleeve is positioned vertically and held stationary, while a feed pipe is introduced from below, by vertical displacement, concentrically into the sleeve. Also from below, an excess of fluid is supplied under pressure, through the feed pipe. The fluid is allowed to emanate from an upper end outlet of the feed pipe and allowed to flow by gravity in the small gap which is formed between the feed pipe and the internal walls of the sleeve. The internal walls of the sleeve are thereby coated with the fluid, while at the same time, the coating of the outside of the sleeve is prevented. The invention also relates to a writing pen comprising a coated sleeve.
摘要:
A circuit arrangement comprises a circuit board (10), a semi-conductor (12) provided on a first side of the circuit board, and a heat sink (15) provided on a second side of the circuit board opposite to the first side and in heat transferring contact with the power semi-conductor. A heat conductive element (13) is provided in a hole (10a) in the circuit board, wherein the heat conductive element is positioned in heat transferring contact with both the semi-conductor and the heat sink for transfer of heat generated by the semi-conductor to the heat sink. A circuit arrangement is provided, wherein the provision of a low thermal resistance path through the circuit board by means of heat conductive elements provides a compact circuit arrangement well suited for assembly by means of an automated surface mounting process.