发明申请
- 专利标题： Self-releasing spring structures and methods
- 专利标题（中）： 自释弹簧结构及方法
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申请号： US10959180申请日： 2004-10-07
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公开(公告)号： US20060076693A1公开(公告)日： 2006-04-13
- 发明人: Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
- 申请人： Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
- 申请人地址： US CA Palo Alto
- 专利权人： PALO ALTO RESEARCH CENTER INCORPORATED
- 当前专利权人： PALO ALTO RESEARCH CENTER INCORPORATED
- 当前专利权人地址： US CA Palo Alto
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
公开/授权文献
- US07456092B2 Self-releasing spring structures and methods 公开/授权日：2008-11-25