公开(公告)号：US20060076693A1

公开(公告)日：2006-04-13

申请号：US10959180

申请日：2004-10-07

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

IPC分类号： H01L23/52

CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

公开(公告)号：US20060105122A1

公开(公告)日：2006-05-18

申请号：US10986712

申请日：2004-11-12

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene Chow ,  Gordon Jagerson

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene Chow ,  Gordon Jagerson

IPC分类号： B31B45/00

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

公开(公告)号：US20060057031A1

公开(公告)日：2006-03-16

申请号：US11267762

申请日：2005-11-03

申请人： Thomas Hantschel ,  David Fork ,  Eugene Chow ,  Dirk De Bruyker ,  Michel Rosa

发明人： Thomas Hantschel ,  David Fork ,  Eugene Chow ,  Dirk De Bruyker ,  Michel Rosa

IPC分类号： B01L3/00 ,  G01N33/00

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

公开(公告)号：US20050006829A1

公开(公告)日：2005-01-13

申请号：US10615653

申请日：2003-07-08

申请人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

发明人： Eugene Chow ,  David Fork ,  Thomas Hantschel ,  Koenraad Van Schuylenbergh ,  Christopher Chua

IPC分类号： F16F1/02 ,  H01L27/148 ,  F16F1/00 ,  F16F9/00 ,  H01L29/768

CPC分类号： F16F1/027

摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

公开(公告)号：US20060087335A1

公开(公告)日：2006-04-27

申请号：US10971467

申请日：2004-10-21

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： G01R31/02

CPC分类号： H01G5/18 ,  G01R1/06738

摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.

摘要翻译： 弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

公开(公告)号：US20070125486A1

公开(公告)日：2007-06-07

申请号：US11292474

申请日：2005-12-02

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： B32B37/00

CPC分类号： B81B3/001 ,  B81B2207/07 ,  B81C1/00666 ,  B81C1/00952 ,  G01R1/06722 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H05K3/4092

摘要： A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.

摘要翻译： 提供多个垂直间隔开的微弹簧以增加微弹簧接触力，接触面积，接触可靠性和接触屈服。 微珠材料作为单层或作为多个子层的复合材料沉积，沿其横截面具有定制的应力差。 可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力，或者向下推动抵靠基底以确保制造过程中的释放。 可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。 微弹簧也可以在其远端物理连接以增加接触力。 微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。

公开(公告)号：US20070069751A1

公开(公告)日：2007-03-29

申请号：US11549066

申请日：2006-10-12

申请人： Thomas Hantschel ,  Eugene Chow

发明人： Thomas Hantschel ,  Eugene Chow

IPC分类号： G01R31/02

CPC分类号： H01G5/18 ,  G01R1/06738

摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.

摘要翻译： 弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

公开(公告)号：US20060009051A1

公开(公告)日：2006-01-12

申请号：US11226186

申请日：2005-09-13

申请人： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

发明人： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC分类号： H01R12/00

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20070145523A1

公开(公告)日：2007-06-28

申请号：US11319056

申请日：2005-12-28

申请人： Eugene Chow ,  Koenraad Schuylenbergh ,  David Fork ,  JengPing Lu

发明人： Eugene Chow ,  Koenraad Schuylenbergh ,  David Fork ,  JengPing Lu

IPC分类号： H01L29/00

CPC分类号： H01G5/18 ,  B81B3/0051 ,  H01F17/0006 ,  H01F17/02 ,  H01F21/04 ,  H01F27/40 ,  H01L28/10 ,  H01L28/60

摘要： Method for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A variable capacitors may employ stops between a moveable electrode and a fixed electrode to reduce and/or prevent electrical shorting between the moveable and fixed electrode. A capacitor may employ a split bottom electrode structure to removing a suspension portion of a moveable top electrode from an RF part of a circuit.

摘要翻译： 描述了在衬底上整体形成高Q可调电容器和高Q电感器的方法。 可变电容器可以在可移动电极和固定电极之间使用停止以减少和/或防止可移动和固定电极之间的电短路。 电容器可以采用分离的底部电极结构来从电路的RF部分去除可移动顶部电极的悬挂部分。

公开(公告)号：US20060038643A1

公开(公告)日：2006-02-23

申请号：US10923277

申请日：2004-08-20

申请人： Baomin Xu ,  David Fork ,  Michael Young ,  Eugene Chow

发明人： Baomin Xu ,  David Fork ,  Michael Young ,  Eugene Chow

IPC分类号： H01H51/22

CPC分类号： G11C23/00 ,  F03G7/065 ,  F04B17/003 ,  F05C2201/0412 ,  F05C2203/0813 ,  F05C2251/00 ,  F05C2251/08 ,  H01L41/094

摘要： Disclosed is a MEMS device which comprises at least one shape memory material such as a shape memory alloy (SMA) layer and at least one stressed material layer. Examples of such MEMS devices include an actuator, a micropump, a microvalve, or a non-destructive fuse-type connection probe. The device exhibits a variety of improved properties, for example, large deformation ability and high energy density. Also provided is a method of easily fabricating the MEMS device in the form of a cantilever-type or diaphragm-type structure.

摘要翻译： 公开了一种MEMS器件，其包括至少一种形状记忆材料，例如形状记忆合金（SMA）层和至少一个应力材料层。 这种MEMS器件的实例包括致动器，微型泵，微型阀或非破坏性熔丝式连接探针。 该装置具有各种改进的性能，例如，大的变形能力和高的能量密度。 还提供了以悬臂式或隔膜式结构的形式容易地制造MEMS器件的方法。