公开(公告)号：US07884361B2

公开(公告)日：2011-02-08

申请号：US12817127

申请日：2010-06-16

Applicant: William Wong ,  Rene Lujan ,  Eugene Chow

Inventor： William Wong ,  Rene Lujan ,  Eugene Chow

IPC: H01L21/00

CPC classification number: H01L29/41733 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1288 ,  H01L27/1292 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66757

Abstract: A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.

Abstract translation: 公开了一种自对准薄膜顶栅晶体管及其制造方法。 通过数字光刻在金属层上形成第一印刷图案掩模，例如通过使用液滴喷射器用相变材料进行印刷。 然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。 在其上形成半导体层和绝缘层。 然后将一层感光材料沉积并暴露通过基底，源极和漏极用作曝光的掩模。 在感光材料的显影之后，沉积栅极金属层。 然后再次通过数字光刻法在器件上形成第二印刷图案掩模。 蚀刻和去除感光材料离开自对准顶栅电极。

公开(公告)号：US20080089705A1

公开(公告)日：2008-04-17

申请号：US11959030

申请日：2007-12-18

Applicant: Jeng Ping Lu ,  Eugene Chow

Inventor： Jeng Ping Lu ,  Eugene Chow

IPC: H05K3/32 ,  G03G15/00

CPC classification number: H01L25/50 ,  H01L21/67271 ,  H01L21/67282 ,  H01L21/67294 ,  H01L24/95 ,  H01L2224/95085 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53004 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53278 ,  H01L2924/00

Abstract: Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.

Abstract translation: 公开了静电印刷微组装系统和方法。 系统和方法涉及操纵电荷编码的微物体。 电荷编码识别每个微物体并指定其排列方向。 微物体在分类单元中排序，使得它们具有定义的位置和取向。 分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。 分类的微物体被提供给图像传送单元。 图像传送单元适于接收分类的微物体，将它们保持在排列顺序和方位，并将其传送到基底。 将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现，如在静电复印中所做的那样。 具有微物体的衬底被进一步处理以使例如微通孔电线互连，以形成最终的微组件。

公开(公告)号：US20070158816A1

公开(公告)日：2007-07-12

申请号：US11331656

申请日：2006-01-12

Applicant: Eugene Chow ,  Christopher Chua ,  Eric Peeters

Inventor： Eugene Chow ,  Christopher Chua ,  Eric Peeters

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L24/11 ,  G01R1/06727 ,  G01R1/06761 ,  G01R3/00 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/742 ,  H01L24/81 ,  H01L2221/68368 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01082 ,  H01L2924/14

Abstract: A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.

Abstract translation: 提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。 接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。 接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。 接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。 接合焊盘粘附到接合焊盘平台上。 然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

公开(公告)号：US20070026585A1

公开(公告)日：2007-02-01

申请号：US11193847

申请日：2005-07-28

Applicant: William Wong ,  Rene Lujan ,  Eugene Chow

Inventor： William Wong ,  Rene Lujan ,  Eugene Chow

IPC: H01L21/84

CPC classification number: H01L29/41733 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1288 ,  H01L27/1292 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/66757

Abstract: A self-aligned, thin-film, top-gate transistor and method of manufacturing same are disclosed. A first print-patterned mask is formed over a metal layer by digital lithography, for example by printing with a phase change material using a droplet ejector. The metal layer is then etched using the first print-patterned mask to form source and drain electrodes. A semiconductive layer and an insulative layer are formed thereover. A layer of photosensitive material is then deposited and exposed through the substrate, with the source and drain electrodes acting as masks for the exposure. Following development of the photosensitive material, a gate metal layer is deposited. A second print-patterned mask is then formed over the device, again by digital lithography. Etching and removal of the photosensitive material leaves the self-aligned top-gate electrode.

Abstract translation: 公开了一种自对准薄膜顶栅晶体管及其制造方法。 通过数字光刻在金属层上形成第一印刷图案掩模，例如通过使用液滴喷射器用相变材料进行印刷。 然后使用第一印刷图案化掩模蚀刻金属层以形成源极和漏极。 在其上形成半导体层和绝缘层。 然后将一层感光材料沉积并暴露通过基底，源极和漏极用作曝光的掩模。 在感光材料的显影之后，沉积栅极金属层。 然后再次通过数字光刻法在器件上形成第二印刷图案掩模。 蚀刻和去除感光材料离开自对准顶栅电极。

公开(公告)号：US20060105122A1

公开(公告)日：2006-05-18

申请号：US10986712

申请日：2004-11-12

Applicant: Thomas Hantschel ,  Sven Kosgalwies ,  Eugene Chow ,  Gordon Jagerson

Inventor： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene Chow ,  Gordon Jagerson

IPC: B31B45/00

CPC classification number: B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

公开(公告)号：US20120239987A1

公开(公告)日：2012-09-20

申请号：US13049637

申请日：2011-03-16

Applicant: James Eugene CHOW ,  Tal GARFINKEL ,  Dominic LUCCHETTI

Inventor： James Eugene CHOW ,  Tal GARFINKEL ,  Dominic LUCCHETTI

IPC: G06F11/07 ,  G06F9/455

CPC classification number: G06F9/45533 ,  G06F11/3636 ,  G06F11/366

Abstract: Execution behavior for processes within a virtual machine is recorded for subsequent replay. The execution behavior comprises a detailed, low-level recording of state changes for processes within the virtual machine. The low-level recording is processed via replay to produce a sliced recording that conforms to time, abstraction, and security requirements for a specific replay scenario. Multiple stages of replay may be arbitrarily stacked to generate different crosscut versions of a common low-level recording.

Abstract translation: 记录虚拟机中进程的执行行为，以便后续重播。 执行行为包括虚拟机内进程的状态变化的详细低级记录。 通过重放来处理低级记录，以产生符合特定重播场景的时间，抽象和安全要求的分片记录。 可以任意堆叠多个重放阶段以产生普通低级记录的不同横切版本。

公开(公告)号：US20110167526A1

公开(公告)日：2011-07-07

申请号：US13045042

申请日：2011-03-10

Applicant: Eugene Chow ,  Pengfei Qi

Inventor： Eugene Chow ,  Pengfei Qi

IPC: G01Q70/08 ,  B82Y30/00

CPC classification number: B81C1/0015 ,  B81B2203/019 ,  B81B2207/07 ,  B82Y10/00

Abstract: A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once formed, the length of the nanowire may be defined, for example photolithographically. A sacrificial layer underlying the microspring may then be removed, allowing the engineered stresses in the microspring to cause the structure to bend out of plane, elevating the nanowire off the substrate and out of plane. Use of the nanowire as a contact is thereby provided. The nanowire may be clamped at the tip of the microspring for added robustness. The nanowire may be coated during the formation process to provide additional functionality of the final device.

Abstract translation: 应力工程微球通常在基底的平面上形成。 纳米线（或等效地，纳米管）也在其顶端形成在基板的平面中。 一旦形成，可以例如光刻地限定纳米线的长度。 然后可以去除位于微弹簧下面的牺牲层，允许微弹簧中的工程应力使结构弯曲出平面，从而使纳米线离开基底并离开平面。 由此提供了使用纳米线作为接触。 可以将纳米线夹在微弹簧的末端以增加坚固性。 在形成过程中可以涂覆纳米线以提供最终装置的附加功能。

公开(公告)号：US20090322845A1

公开(公告)日：2009-12-31

申请号：US12145677

申请日：2008-06-25

Applicant: Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

Inventor： Timothy D. Stowe ,  Chu-heng Liu ,  Jeng Ping Lu ,  Eugene Chow ,  Gregory B. Anderson ,  Armin Volkel ,  Eric Peeters

IPC: B41J2/41

CPC classification number: B41J2/41 ,  G03G15/32

Abstract: An addressable imaging belt for use in printing applications having embedded anisotropically conductive addressable islands configured for electric contact on a first side of the belt by a write head consisting of an array of compliant cantilevered fingers with contact pads/points to which a voltage can be applied. The conductive addressable islands electrically isolated from one another and extending substantially through the thickness of the belt in order to allow charge to flow through the belt towards a second side of the belt, in order to form a latent electrostatic image on the second side and develop this latent image by attracting colorized toner or other electrically charged particles to the second side.

Abstract translation: 一种用于印刷应用的可寻址成像带，其具有嵌入的各向异性导电可寻址岛，其配置用于通过由柔性悬臂指状物阵列组成的写头组成，用于在带的第一侧上进行电接触，所述写头具有可被施加电压的接触焊盘/点 。 导电寻址岛彼此电隔离并且基本上延伸穿过带的厚度，以便允许电荷通过带流向带的第二侧，以在第二面上形成静电潜像并显影 该潜像通过将着色调色剂或其它带电粒子吸引到第二侧。

公开(公告)号：US20070125486A1

公开(公告)日：2007-06-07

申请号：US11292474

申请日：2005-12-02

Applicant: Thomas Hantschel ,  Eugene Chow

Inventor： Thomas Hantschel ,  Eugene Chow

IPC: B32B37/00

CPC classification number: B81B3/001 ,  B81B2207/07 ,  B81C1/00666 ,  B81C1/00952 ,  G01R1/06722 ,  G01R1/06727 ,  G01R1/06744 ,  G01R3/00 ,  H05K3/4092

Abstract: A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.

Abstract translation: 提供多个垂直间隔开的微弹簧以增加微弹簧接触力，接触面积，接触可靠性和接触屈服。 微珠材料作为单层或作为多个子层的复合材料沉积，沿其横截面具有定制的应力差。 可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力，或者向下推动抵靠基底以确保制造过程中的释放。 可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。 微弹簧也可以在其远端物理连接以增加接触力。 微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。

公开(公告)号：US20070069751A1

公开(公告)日：2007-03-29

申请号：US11549066

申请日：2006-10-12

Applicant: Thomas Hantschel ,  Eugene Chow

Inventor： Thomas Hantschel ,  Eugene Chow

IPC: G01R31/02

CPC classification number: H01G5/18 ,  G01R1/06738

Abstract: A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.

Abstract translation: 弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。 弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。 然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。 细长部分由与包覆层同时沉积的电镀材料形成。 为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。