- 专利标题: Magnetic logic device and methods of manufacturing and operating the same
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申请号: US11320898申请日: 2005-12-30
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公开(公告)号: US20060145806A1公开(公告)日: 2006-07-06
- 发明人: Sung-dong Kim , Eun-sik Kim , Ju-hwan Jung , Hyoung-soo Ko , Dong-ki Min , Hong-sik Park , Seung-bum Hong
- 申请人: Sung-dong Kim , Eun-sik Kim , Ju-hwan Jung , Hyoung-soo Ko , Dong-ki Min , Hong-sik Park , Seung-bum Hong
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 优先权: KR10-2004-0117010 20041230
- 主分类号: H01F5/00
- IPC分类号: H01F5/00
摘要:
A magnetic logic device (MLD) and methods of manufacturing and operating an MLD are provided. The MLD includes: a first interconnection; a lower magnetic layer formed on the first interconnection, the lower magnetic layer having a magnetization direction fixed in a predetermined direction; a non-magnetic layer formed on the lower magnetic layer; an upper magnetic layer formed on the non-magnetic layer, the upper magnetic layer having a magnetization direction parallel or anti-parallel to the magnetization direction of the lower magnetic layer; and a second interconnection formed on the upper magnetic layer. A first current source is disposed between one end of the first interconnection and one end of the second interconnection and a second current source is disposed between the other end of the first interconnection and the other end of the second interconnection.
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