发明申请
US20060188821A1 Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition
有权
光敏树脂，具有感光性树脂的光致抗蚀剂组合物和使用光致抗蚀剂组合物形成光刻胶图案的方法
- 专利标题： Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition
- 专利标题（中）： 光敏树脂，具有感光性树脂的光致抗蚀剂组合物和使用光致抗蚀剂组合物形成光刻胶图案的方法
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申请号： US11350559申请日： 2006-02-08
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公开(公告)号： US20060188821A1公开(公告)日： 2006-08-24
- 发明人: Seok Han , Sangwoong Yoon , Young-Ho Kim
- 申请人： Seok Han , Sangwoong Yoon , Young-Ho Kim
- 优先权： KR2005-13598 20050218
- 主分类号： G03C1/76
- IPC分类号： G03C1/76
摘要：
In a photosensitive resin, a photoresist composition including the photosensitive resin and a method of forming a photoresist pattern using the photoresist composition, the photosensitive resin includes a hydrophobic terminal group having at least five carbon atoms and a blocking group. The photosensitive resin has a weight average molecular weight of from about 6,000 up to about 9,500. The photoresist composition including the photosensitive resin may form a photoresist pattern having a reduced line edge roughness and a fine line width with accuracy.