- 专利标题： Methods of spin-on wafer cleaning
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申请号： US11072114申请日： 2005-03-04
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公开(公告)号： US20060196526A1公开(公告)日： 2006-09-07
- 发明人: Jun Wu , Dong-Xuan Lu , Shih-Chi Lin , Wen-Long Lee , Yi-An Jian , Guang-Cheng Wang , Shiu-Ko JangJian , Chyi-Tsong Ni , Szu-An Wu , Ying-Lang Wang
- 申请人： Jun Wu , Dong-Xuan Lu , Shih-Chi Lin , Wen-Long Lee , Yi-An Jian , Guang-Cheng Wang , Shiu-Ko JangJian , Chyi-Tsong Ni , Szu-An Wu , Ying-Lang Wang
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 主分类号： C23G1/00
- IPC分类号： C23G1/00 ; B08B7/00 ; B08B3/00
摘要：
A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 to 100 KPa.
公开/授权文献
- US07611589B2 Methods of spin-on wafer cleaning 公开/授权日：2009-11-03
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